New 2D simulation model of electromigration

Hewlett-Packard Journal

Volumn 40, Issue 3, 1989, Pages 79-84

  Marcoux, Paul J ^a   Merchant, Paul P ^a   Naroditsky, Vladimir ^a   Rehder, Wulf D ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUIT MANUFACTURE--METALLIZING;

2D SIMULATION; ELECTROMIGRATION; VLSI CHIPS;

INTEGRATED CIRCUITS, VLSI;

EID: 0024680091     PISSN: 00181153     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (15)