Basic BEOL parameters from isothermal wafer level electromigration testing

International Integrated Reliability Workshop Final Report

Volumn , Issue , 2000, Pages 80-84

  Sullivan, Tim D ^a   Lee, Tom ^a   Tibel, Deborah ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; CURRENT DENSITY; ELECTROMIGRATION; HEAT RESISTANCE; RELIABILITY; SILICON WAFERS; SUBSTRATES; THERMAL CONDUCTIVITY;

THERMAL COEFFICIENT OF RESISTANCE (TCR); WAFER LEVEL RELIABILITY (WLR);

SEMICONDUCTOR DEVICE TESTING;

EID: 0034427769     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)