Bottom-up approach for carbon nanotube interconnects

Applied Physics Letters

Volumn 82, Issue 15, 2003, Pages 2491-2493

  Li, Jun ^a   Ye, Qi ^a   Cassell, Alan ^a   Ng, Hou Tee ^a   Stevens, Ramsey ^a   Han, Jie ^a   Meyyappan, M ^a  

^a NASA AMES RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CATALYSTS; INTEGRATED CIRCUIT MANUFACTURE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS;

DIELECTRIC GAP FILLING;

CARBON NANOTUBES;

EID: 0038665264     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1566791     Document Type: Article

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