-
4
-
-
0003569075
-
-
Zeiger, Stuttgart
-
I. Kaur, W. Gust, and L. Kozma, Handbook of Grain and Interface Boundary Diffusion Data (Zeiger, Stuttgart, 1989), p. 380.
-
(1989)
Handbook of Grain and Interface Boundary Diffusion Data
, pp. 380
-
-
Kaur, I.1
Gust, W.2
Kozma, L.3
-
5
-
-
0028573842
-
-
D. Gupta, MRS Proc. 337, 209 (1994); Mater. Chem. Phys. 41, 199 (1995).
-
(1994)
MRS Proc.
, vol.337
, pp. 209
-
-
Gupta, D.1
-
6
-
-
0029354520
-
-
D. Gupta, MRS Proc. 337, 209 (1994); Mater. Chem. Phys. 41, 199 (1995).
-
(1995)
Mater. Chem. Phys.
, vol.41
, pp. 199
-
-
-
8
-
-
0028698548
-
-
Materials Reliability in Microelectronics IV, edited by P. Borgesen, J. C. Coburn, J. E. Sanchez, K. Rodbell, and W. Filter MRS, Pittsburgh, PA
-
S. Shingubara, K. Fujiki, A. Sano, H. Sakaui, and Y. Horikie, in Materials Reliability in Microelectronics IV, MRS Proc. Vol. 338, edited by P. Borgesen, J. C. Coburn, J. E. Sanchez, K. Rodbell, and W. Filter (MRS, Pittsburgh, PA, 1994), p. 441.
-
(1994)
MRS Proc. Vol. 338
, vol.338
, pp. 441
-
-
Shingubara, S.1
Fujiki, K.2
Sano, A.3
Sakaui, H.4
Horikie, Y.5
-
11
-
-
0011735695
-
-
Materials Reliability in Microelectronics II, edited by C. V. Tompson and J. R. Lloyd MRS, Pittsburgh, PA
-
C.-K. Hu, M. B. Small, and P. S. Ho, in Materials Reliability in Microelectronics II, MRS Proc. Vol. 265, edited by C. V. Tompson and J. R. Lloyd (MRS, Pittsburgh, PA, 1992), p. 171.
-
(1992)
MRS Proc. Vol. 265
, vol.265
, pp. 171
-
-
Hu, C.-K.1
Small, M.B.2
Ho, P.S.3
-
12
-
-
0029325535
-
-
C.-K. Hu, B. Luther, F. B. Kaufman, J. Hummel, C. Uzoh, and D. J. Pearson, Thin Solid Films 262, 84 (1995).
-
(1995)
Thin Solid Films
, vol.262
, pp. 84
-
-
Hu, C.-K.1
Luther, B.2
Kaufman, F.B.3
Hummel, J.4
Uzoh, C.5
Pearson, D.J.6
-
13
-
-
84954105890
-
-
IEEE, New York
-
T. Ohmi, T. Hoshi, Y. Yoshie, T. Takewaki, M. Otsuki, T. Shibata, and T. Nitta, Technical Digest of IEDM (IEEE, New York, 1991), p. 285.
-
(1991)
Technical Digest of IEDM
, pp. 285
-
-
Ohmi, T.1
Hoshi, T.2
Yoshie, Y.3
Takewaki, T.4
Otsuki, M.5
Shibata, T.6
Nitta, T.7
-
15
-
-
0343367701
-
-
IEEE, New York
-
H.-K. Kang, I. Asano, C. Ryu, and S. S. Wong, Proceedings of IEEE VHIC Conference (IEEE, New York, 1993), p. 223.
-
(1993)
Proceedings of IEEE VHIC Conference
, pp. 223
-
-
Kang, H.-K.1
Asano, I.2
Ryu, C.3
Wong, S.S.4
-
17
-
-
0016940795
-
-
I. A. Blech, J. Appl. Phys. 47, 1203 (1977); ibid. 48, 2648 (1978).
-
(1977)
J. Appl. Phys.
, vol.47
, pp. 1203
-
-
Blech, I.A.1
-
18
-
-
0016940795
-
-
I. A. Blech, J. Appl. Phys. 47, 1203 (1977); ibid. 48, 2648 (1978).
-
(1978)
J. Appl. Phys.
, vol.48
, pp. 2648
-
-
-
19
-
-
0000020292
-
-
C.-K. Hu, M. B. Small, K. Rodbell, C. Stanis, B. Blauber, and P. S. Ho, J. Appl. Phys. 62, 1023 (1993).
-
(1993)
J. Appl. Phys.
, vol.62
, pp. 1023
-
-
Hu, C.-K.1
Small, M.B.2
Rodbell, K.3
Stanis, C.4
Blauber, B.5
Ho, P.S.6
-
22
-
-
0001152208
-
-
L. M. Klinger, E. E. Glickman, V. E. Fradkov, W. W. Mullins, and C. L. Bauer, J. Appl. Phys. 78, 3833 (1995).
-
(1995)
J. Appl. Phys.
, vol.78
, pp. 3833
-
-
Klinger, L.M.1
Glickman, E.E.2
Fradkov, V.E.3
Mullins, W.W.4
Bauer, C.L.5
-
23
-
-
0029538401
-
-
Materials Reliability in Microelectronics V, edited by A. S. Oates, W. F. Filter, R. Rosenberg, A. L. Greer, and K. Gadepally MRS, Pittsburgh, PA
-
L. M. Klinger, E. E. Glickman, V. E. Fradkov, W. W. Mullins, and C. L. Bauer, in Materials Reliability in Microelectronics V, MRS Proc., Vol. 391, edited by A. S. Oates, W. F. Filter, R. Rosenberg, A. L. Greer, and K. Gadepally (MRS, Pittsburgh, PA, 1995), p. 295.
-
(1995)
MRS Proc.
, vol.391
, pp. 295
-
-
Klinger, L.M.1
Glickman, E.E.2
Fradkov, V.E.3
Mullins, W.W.4
Bauer, C.L.5
-
25
-
-
0029477464
-
-
Materials Reliability in Microelectronics V, edited by A. S. Oates, W. F. Filter, R. Rosenberg, A. L. Greer, and K. Gadepally MRS, Pittsburgh, PA
-
E. E. Glickman and L. M. Klinger, in Materials Reliability in Microelectronics V, MRS Proc. Vol. 391, edited by A. S. Oates, W. F. Filter, R. Rosenberg, A. L. Greer, and K. Gadepally (MRS, Pittsburgh, PA, 1995), p. 243.
-
(1995)
MRS Proc.
, vol.391
, pp. 243
-
-
Glickman, E.E.1
Klinger, L.M.2
-
28
-
-
0025535614
-
-
IEEE, New York
-
K. Hoshino, H. Yagi, and H. Tsuchikawa, Proceedings of IEEE VMIC Conference (IEEE, New York, 1990), p. 357.
-
(1990)
Proceedings of IEEE VMIC Conference
, pp. 357
-
-
Hoshino, K.1
Yagi, H.2
Tsuchikawa, H.3
-
30
-
-
85033851686
-
-
The limits |a*| and |a**| are determined solely by μ, and for μ=1/6 are 2.0 and 7.7, respectively. For a values between |a*| and |**| both regimes can coexist, and the one which will dominate depends on the initial conditions (see Ref. 20)
-
The limits |a*| and |a**| are determined solely by μ, and for μ=1/6 are 2.0 and 7.7, respectively. For a values between |a*| and |**| both regimes can coexist, and the one which will dominate depends on the initial conditions (see Ref. 20).
-
-
-
-
31
-
-
1842490099
-
Surface Diffusion on Metals
-
Springer, Berlin-Heidelberg
-
H. P. Bonzel, "Surface Diffusion on Metals," in Landolt-Börnstein, New Series, III/26, Diffusion in Solid Metals and Alloys (Springer, Berlin-Heidelberg, 1990), p. 717.
-
(1990)
Landolt-Börnstein, New Series, III/26, Diffusion in Solid Metals and Alloys
, pp. 717
-
-
Bonzel, H.P.1
-
33
-
-
12344310018
-
-
F. Delamare and G. E. Rhead, Surf. Sci. 28, 267 (1971); ibid. 35, 172 (1973).
-
(1973)
Surf. Sci.
, vol.35
, pp. 172
-
-
-
34
-
-
0025488308
-
-
C. A. Ross, J. S. Drewery, R. E. Somekh, and J. E. Evetts, J. Electron Mater. 19, 911 (1990); J. Appl. Phys. 16, 2349 (1990).
-
(1990)
J. Electron Mater.
, vol.19
, pp. 911
-
-
Ross, C.A.1
Drewery, J.S.2
Somekh, R.E.3
Evetts, J.E.4
-
35
-
-
0025488308
-
-
C. A. Ross, J. S. Drewery, R. E. Somekh, and J. E. Evetts, J. Electron Mater. 19, 911 (1990); J. Appl. Phys. 16, 2349 (1990).
-
(1990)
J. Appl. Phys.
, vol.16
, pp. 2349
-
-
-
37
-
-
85033840871
-
-
note
-
EM) might be underestimated: recent observations in Al show that the mass of residual material increases with j (Refs. 22, 23), and this should decrease the sheet resistance of the freshly exposed refractory underlayer.
-
-
-
-
38
-
-
85033847563
-
-
note
-
The latter effect was studied recently with SEM/EDS in Al stripes (see Refs. 22, 23). The flux I in drift velocity experiments was varied either by changes in the stripe length, which alters the contribution from the stress-gradient driven back flux (see Ref. 16), or in the current density j. The "residual mass" of islands in the depleted region behind the drifting edge was found to continuously increase with I, and a transition from a truly homogeneous A-type electromigration displacement to the B-type, (with islands), was observed when the flux I was increased at a given temperature, composition and microstructure.
-
-
-
-
42
-
-
5544239090
-
-
E. E. Glickman, Yu. V. Gorunov, Yu. V. Piguzov, I. Y. Rzhevskaya, and B. Ya. Tokarev, Sov. Phys. Met. Metall. 44, 553 (1976).
-
(1976)
Sov. Phys. Met. Metall.
, vol.44
, pp. 553
-
-
Glickman, E.E.1
Gorunov, Yu.V.2
Piguzov, Yu.V.3
Rzhevskaya, I.Y.4
Tokarev, B.Ya.5
-
46
-
-
0003569075
-
-
Zeiger, Stuttgart
-
I. Kaur and W. Gust, Fundamentals of Grain and Interphase Boundary Diffusion, 2nd ed. (Zeiger, Stuttgart, 1989), p. 300.
-
(1989)
Fundamentals of Grain and Interphase Boundary Diffusion, 2nd Ed.
, pp. 300
-
-
Kaur, I.1
Gust, W.2
-
47
-
-
0019636172
-
-
B. B. Straumal, B. S. Bokstein, L. M. Klinger, and L. S. Shvindlerman, Scr. Metall. 15, 1197 (1981).
-
(1981)
Scr. Metall.
, vol.15
, pp. 1197
-
-
Straumal, B.B.1
Bokstein, B.S.2
Klinger, L.M.3
Shvindlerman, L.S.4
-
49
-
-
85033841984
-
-
Groove extension along a grain boundary nearly orthogonal to current direction was proposed to be an electromigration failure mechanism in bicrystalline Al lines by Longworth and Thompson (see Ref. 46)
-
Groove extension along a grain boundary nearly orthogonal to current direction was proposed to be an electromigration failure mechanism in bicrystalline Al lines by Longworth and Thompson (see Ref. 46).
-
-
-
-
50
-
-
0042145091
-
-
Materials Reliability in Microelectronics II, edited by C. V. Thompson and J. R. Lloyd MRS, Pittsburgh, PA
-
H. P. Longworth and C. V. Thompson, in Materials Reliability in Microelectronics II, MRS, Proc. Vol. 265, edited by C. V. Thompson and J. R. Lloyd (MRS, Pittsburgh, PA, 1992), p. 95.
-
(1992)
MRS, Proc.
, vol.265
, pp. 95
-
-
Longworth, H.P.1
Thompson, C.V.2
-
51
-
-
0001215997
-
-
T. Fukada, T. Mori, Y. Tayoda, M. Hasugawa, K. Namba, and K. Ogata, Appl. Surf. Sci. 91, 227 (1995).
-
(1995)
Appl. Surf. Sci.
, vol.91
, pp. 227
-
-
Fukada, T.1
Mori, T.2
Tayoda, Y.3
Hasugawa, M.4
Namba, K.5
Ogata, K.6
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