Highly preferred (111) texture aluminum-copper films formed with argon plasma treatment of the titanium underlayer and their electromigration endurance as interconnects

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 15, Issue 4, 1997, Pages 961-966

  Kamoshida, Kazuyoshi ^a   Ito, Yasuyuki ^a  

^a NTT CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0000788157     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.589515     Document Type: Article

References (23)

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