Reduction in flux divergence at vias for improved electromigration in multilayered AlCu interconnects

Applied Physics Letters

Volumn 69, Issue 14, 1996, Pages 2134-2136

  Ting, Larry ^a   Hong, Qi Zhong ^a   Hsu, Wei Yung ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 6044259177     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.117178     Document Type: Article

References (11)

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