Direct observation of void morphology in step-like electromigration resistance behavior and its correlation with critical current density

Journal of Applied Physics

Volumn 89, Issue 4, 2001, Pages 2130-2133

  Huang, J S ^a   Shofner, T L ^a   Zhao, J ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0001169065     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1340004     Document Type: Article

References (11)

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