Electromigration-induced surface evolution in bamboo lines with transgranular and intergranular edge voids

Thin Solid Films

Volumn 466, Issue 1-2, 2004, Pages 347-350

  Nathan, Menachem ^a   Averbuch, Amir ^a   Israeli, Moshe ^b  

^a TEL AVIV UNIVERSITY   (Israel)

^b TECHNION ISRAEL INSTITUTE OF TECHNOLOGY   (Israel)

Author keywords

Electromigration; Modeling; Simulation; Surface evolution

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DIFFUSION; ELECTRIC FIELD EFFECTS; ELECTROMIGRATION; GRAIN BOUNDARIES; INTERFACES (MATERIALS); PARAMETER ESTIMATION; THIN FILMS;

ANODE MASS ACCUMULATION; MODELING; SURFACE DIFFUSION; SURFACE EVOLUTION;

SURFACE PHENOMENA;

EID: 4544302330     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.03.019     Document Type: Article

References (9)

1. Mullins W.W. J. Appl. Phys. 28:1957;333.
2. See e.g. Sun B., Suo Z. Acta Mater. 45:1997;4953.
3. Schimschak M., Krug J. Phys. Rev. Lett. 78:1997;278.
4. Schimschak M., Krug J. J. Appl. Phys. 87:2000;695.
5. Gungor M.R., Maroudas D. J. Appl. Phys. 85:1999;2233.
6. Oren E.E., Ogurtani T.O. MRS Symp. Proc. 695:2002;209.
7. Averbuch A., Israeli M., Nathan M., Ravve I. J. Comp. Phys. 188:2003;640.
8. Augur R.A., Wolters R.A., Schmidt W., Dirks A.G., Kordic S. J. Appl. Phys. 79:1996;3003.
9. Arnaud L., Berger T., Reimbold G. J. Appl. Phys. 93:2003;192.