Effect of surface treatment on electromigration in sub-micron Cu damascene interconnects

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 325-329

  Vairagar, A V ^a,b   Mhaisalkar, S G ^a   Krishnamoorthy, Ahila ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Cu interconnects; Damascene; Electromigration; Surface treatment

Indexed keywords

DAMASCENE; INTERCONNECTS; INTERFACIAL ELECTROMIGRATION;

CRYSTAL MICROSTRUCTURE; DIELECTRIC MATERIALS; ELECTROMIGRATION; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMAS; POLISHING;

COPPER;

EID: 4344609102     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.082     Document Type: Article

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