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Journal of the Electrochemical Society

Volumn 149, Issue 7, 2002, Pages

Electromigration in on-chip single/dual damascene Cu interconnections

(4) Hu, C K a Gignac, L a Liniger, E a Rosenberg, R a

a IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; CATHODES; COPPER; DIFFUSION; FAILURE ANALYSIS; INTERFACES (MATERIALS);

DAMASCENE INTERCONNECTS;

ELECTROMIGRATION;

EID: 0036642120 PISSN: 00134651 EISSN: None Source Type: Journal
DOI: 10.1149/1.1482057 Document Type: Article

Times cited : (26)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.