Die singulation technologies for advanced packaging: A critical review

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics

Volumn 30, Issue 4, 2012, Pages

  Lei, Wei Sheng ^a   Kumar, Ajay ^a   Yalamanchili, Rao ^a  

^a APPLIED MATERIALS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEGRADATION; FILM GROWTH; PACKAGING; SEMICONDUCTOR DEVICE MANUFACTURE; TECHNOLOGY;

ADVANCED PACKAGING; CRITICAL CHALLENGES; CRITICAL PARAMETER; CRITICAL REVIEW; DIE ATTACH FILM; DIE SEPARATION; DIE STRENGTH; DIE SURFACE; HYBRID METHOD; INTERCONNECT STRUCTURES; KERF GEOMETRY; QUALITY CHARACTERISTIC; SEMICONDUCTOR MANUFACTURING PROCESS; SIDE WALLS; SINGULATION; STACKED STRUCTURE; ULTRA-THIN; UNDERLYING MECHANISM; WAFER DICING;

DIES;

EID: 84864271098     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.3700230     Document Type: Review

References (299)

1. History of the Chip Equipment, Session 5.3: Dicing., VLSI Research, Inc., 1987, retrieved November 23, 2011, http://www.chiphistory.org/documents/dicing. pdf
2. H. Wing and D. K. Seto, Proceedings of the Annual ASTME Engineering Conference and Tool Exposition, 1966, p. 174-1.
3. P. A. Totta and R. P. Sopher, IBM J. Res. Dev. 13, 226 (1969). 10.1147/rd.133.0226
4. G. Olachea, Chip Scale Rev. 14, 30 (2010).
5. K. Gurnett and T. Adams, Semicond. Manuf. 7, 19 (2006).
6. P. K. Subrahmanyan, Proc. SPIE 4977, 188 (2003). 10.1117/12.479555
7. K. Arai, Y. Kobayashi, and H. Otai, in Semiconductor Manufacturing Handbook, edited by, H. Geng, (McGraw-Hill, New York, 2005), Chap., pp. 20.1-20.22.
8. F. Fukuyo, K. Fukumitsu, and N. Uchiyama, Stealth dicing technology and applications., presented at the 6th International Symposium on Laser Precision Microfabrication, Williamsburg, VA, 4-8 April 2005.
9. A. Kumar, P. C. Nallan, A. Khan, and D. V. Podlesnik, US patent 6,642,127 B2 (4 November 2003).
10. M. A. Hussein and J. He, IEEE Trans. Semicond. Manuf. 18, 69 (2005). 10.1109/TSM.2004.841832
11. L. L. Mercado, S.-M. Kuo, C. Goldberg, and D. Frear, IEEE Trans. Adv. Packag. 26, 433 (2003). 10.1109/TADVP.2003.821084
12. P. J. Wolf, Overview of dual damascene Cu/low-k interconnect., Presented at ERC Retreat Stanford: New Chemistries Tools for scCO2 Processing of Thin Films, Stanford University, August 14, 2003.
13. International Technology Roadmap for Semiconductors-ITRS 2005 edition., retrieved November 23, 2011, http://www.itrs.net/links/2005itrs/home2005.htm
14. K.-I. Hijioka, F. Ito, M. Tagami, H. Ohtake, Y. Harada, T. Takeuchi, S. Saito, and Y. Hayashi, Jpn. J. Appl. Phys. 43, 1807 (2004). 10.1143/JJAP.43.1807
15. D. W. Zheng, Y. H. Xu, Y. P. Tsai, K. N. Tu, P. Patterson, B. Zhao, Q.-Z. Liu, and M. Brongo, Appl. Phys. Lett. 76, 2008 (2000). 10.1063/1.126237
16. A. A. Volinsky, J. B. Vella, and W. W. Gerberich, Thin Solid Films 429, 201 (2003). 10.1016/S0040-6090(03)00406-1
17. S. Allada, Proceedings of the IEEE International Conference on Interconnect Technology, 1999, p. 161.
18. M. Moinpour, Materials challenges in planarization and interconnect technologies., Presented at the International Conference on Planarization/CMP Technology, Dresden, Germany, 25-27 October 2007.
19. W. D. van Driel, Microelectron. Reliab. 47, 1969 (2007). 10.1016/j.microrel.2007.04.009
20. T. Scherban, B. Sun, J. Blaine, C. Block, B. Jin, and E. Andideh, Proceedings of the IEEE International Interconnect Technology Conference, 2001, p. 257.
21. L. L. Mercado, C. Goldberg, S.-M. Kuo, T.-Y. Lee and S. K. Pozder, IEEE Trans. Dev. Mater. Reliab. 3, 111 (2003). 10.1109/TDMR.2003.821541
22. C. Hong, Proceedings of the International Wafer Level Reliability (WLR) Workshop, Final Report, 1992, p. 163.
23. L. Y. Yang, C. King, R. Peng, and E. Gelvin, Proceedings of the 56th Electronic Components Technology Conference, 2006, p. 1893.
24. S. Muthukumar, C. D. Hill, S. Ford, W. Worwag, T. Dambrauskas, P. C. Challela, T. S. Dory, N. M. Patel, E. L. Ramsay, and D. S. Chau, Proceedings of the Electronic Components Technology Conference, 2006, p. 1233.
25. R. J. Albalak, Chip Scale Rev. 9, 37 (2005).
26. J. N. Burghartz, W. Appel, HD. Rempp, and M. Zimmermann, IEEE Trans. Electron. Devices 56, 321 (2009). 10.1109/TED.2009.2010581
27. K. Gurnett and T. Adams, III-Vs Rev. 19, 38 (2006). 10.1016/S0961- 1290(06)71643-X
28. J. N. Burghartz, in Ultra-thin Chip Technology and Applications, 1st ed., edited by, J. N. Burghartz, (Springer Verlag, New York, 2011), Chap., pp. 13-18.
29. A. Dietzel, J. van den Brand, J. Vanfleteren, W. Christiaens, E. Bosman, and J. De Baets, in Ultra-thin Chip Technology and Applications, 1st ed., edited by, J. N. Burghartz, (Springer Verlag, New York, 2011), Chap., pp. 141-157.
30. R. Huemoeller, Thin Wafer Handling Challenges., Presented at SEMI-CON West Conference, San Francisco, July 13, 2010.
31. F. Schnegg, H. Kostner, G. Bock, and S. Engensteiner, in Ultra-thin Chip Technology and Applications, 1st ed., edited by, J. N. Burghartz, (Springer Verlag, New York, 2011), Chap., pp. 167-183.
32. P. McCabe, Adv. Packag. 14, 26 (2005).
33. M. Todd, S. Gupta, and J. T. Huneke, Adv. Packag. 17, 33 (2008).
34. C. L. Chung, C. K. Ku, H. C. Hsu, and S. L. Fu, Proceedings of the European Microelectronic Packaging Conference, 2009, p. 1.
35. T.-Y. Tsai, H.-C. Chang, W.-C. Li, C.-P. Teng, and Y.-S. Lai, Proceedings of the 32nd IEEE/CPMT International Electronics Manufacturing Technology Symposium, 2007, p. 92.
36. C. L. Chung and S. L. Fu, Proceedings of the 15th International Conference on Microelectronics, 2003, p. 365.
37. K. Gilleo and R. Lasky, Reworkable packaging materials-Die attach Underfills., ET Trends LLC, RI, retrieved November 23, 2011, http://www.et-trends.com/files/HDI-Expo-Reworkable2.pdf
38. S.W. Wang and M. C. Yo, Proceedings of the 31th International Electronic Manufacturing Technology (IEMT) Symposium, 2006, p. 207.
39. S. L. Pei-Siang, G. Sharma, A. Kumar, V. S. Rao, and V. L. W. Sheng, Proceedings of the 11th Electronic Packaging Technology Conference, 2009, p. 208.
40. S. Abdullah, S. M. Yusof, A. Jalar, M. F. Abdullah, Z. A. Aziz, and R. Daud, J. Solid State Sci. Technol. 16, 198 (2008).
41. H. H. Jiun, I. Ahmad, A. Jalar, and G. Omar, Proceedings of the IEEE International Conference on Semiconducting Electronics, 2004, p. 636.
42. A. Jalar, M. F. Rosle, and M. A. A. Hamid, WSEAS Trans. Appl. Theor. Mech. 3, 104 (2008).
43. M. Teo, S. C. Kheng, and C. Lee, Process and material characterization of die attach film (DAF) for thin die applications., Presented at the International Conference on Electronic Materials Packaging, Kowloon, Hong Kong, 11-14 December 2006.
44. K. F. Lim, Alternative dicing die attach flim method for high volume small die application., Presented at the 34th International Electronic Manufacturers Technology Conference, Melaka, Malaysia, 30 November-2 December 2010.
45. F. Raimondi, S. Abolhassani, R. Bruetsch, F. Geiger, L. Lippert, J. Wambach, J. Wei, and A. Wokaun, J. Appl. Phys. 88, 3659 (2000). 10.1063/1.1289516
46. V. P. Ganesh and C. Lee, Proceedings of the 8th Electronic Packaging Technology Conference, 2006, p. 15.
47. M. Mendes and J. Park, Adv. Packag. 15, 37 (2006).
48. R. Fox, Dicing improvements: Yield enhancement, throughput increase and die size reduction in M/A-COM's GaAs fab., Presented at the 2001 International Conference on Compound Semiconductor Manufacturing Technology, Las Vegas, NV, 21-24 May 2001.
49. ASTM Standards F1259M-96, Standard Guide for Design of Flat, Straight-Line Test Structures for Detecting Metallization Open-Circuit or Resistance-Increase Failure due to Electromigration., 1996.
50. Sony Semiconductor Quality and Reliability HandBook, Sony Corp., May 2001, retrieved November 23, 2011 http://www.sony.net/Products/SC-HP/tec/ catalog/qr.html, pp. 130-135.
51. J. Harris, Semiconductor Wafer Backside Metallization: Die Attach for high thermal demand applications., CMC Laboratories, retrieved November 23, 2011, http://www.cmclaboratories.com/documents/backside-metallization-of-sc- wafers-IEEE-tutorial-20070417.pdf
52. V. V. Felmetsger, J. Vac. Sci. Technol. B 25, 881 (2007). 10.1116/1.2737441
53. H. Hirscher and H. Auer, Thin film processing, retrieved November 23, 2011, http://www.electroiq.com/articles/ap/2009/03/thin-wafer-processing.html.
54. X. H. Wang, P. T. Lai, and H. W. Choi, J. Appl. Phys. 108, 023110 (2010). 10.1063/1.3456445
55. E. Virey, LED cost and technology trends: How to enable massive adoption in general lighting., Presented at SEMICON West Conference, San Francisco, CA, June 13, 2011.
56. D. Perrottet, S. Green, and B. Richerzhagen, Proceedings of the 17th Annual SEMI/IEEE Advanced Semiconductor Manufacturers Conference (ASMC), 2006, p. 233.
57. S. J. Koester, A. M. Young, R. R. Yu, S. Purushothaman, K.-N. Chen, D. C. La Tulipe, Jr., N. Rana, L. Shi, M. R. Wordeman, and E. Sprogis, IBM J. Res. Dev. 52, 583 (2008). 10.1147/JRD.2008.5388565
58. P. Ramm, A. Klumpp, R. Merkel, J. Weber, R. A. Ostmann, and J. Wolf, Proceedings of the Materials Research Society Spring Meeting, 2003, Vol. 766, p. 3.
59. R. Chanchani, D. T. Bethke, D. B. Webb, C. Sandoval, and G. Wouters, Proceedings of the 54th Electronic Components Technology Conference, 2004, p. 1232.
60. R. J. Albalak, Adv. Packag. 16, 20 (2007).
61. A. P. Malshe, C. O'Neal, S. B. Singh, W. D. Brown, W. P. Eaton, and W. M. Miller, Int. J. Microcirc. Electron. Packag. 22, 233 (1999).
62. J. J. M. Zaal, W. D. van Driel, and G. Q. Zhang, Sensor 10, 3989 (2010). 10.3390/s100403989
63. T. Tekin, IEEE J Sel. Top. Quant. 17, 704 (2011). 10.1109/JSTQE.2011. 2113171
64. Y. Izawa, S. Tanaka, H. Kikuchi, Y. Tsurumi, N. Miyanaga, M. Esashi, and M. Fujita, Proc. MEMS 21, 822 (2008).
65. M. Fujita, Y. Izawa, Y. Tsurumi, S. Tanaka, H. Fukushi, K. Sueda, Y. Nakata, N. Miyanaga, and M. Esashi, IEEJ Trans. Sensor. Micromach. 130, 118 (2010). 10.1541/ieejsmas.130.118
66. K. X. Hu, C.-P. Yeh, B. Doot, A. F. Skipor, and K. W. Wyatt, Proceedings of the 45th Electronic Components Technology Conference, 1995, p. 293.
67. M. Ranjan, L. Gopalakrishnan, K. Srihari, and C. Woychik, Proceedings of the IEEE Electronic Components Technology Conference, 1998, p. 729.
68. S. Michaelides and S. K. Sitaraman, IEEE Trans. Adv. Packag. 22, 602 (1999). 10.1109/6040.803452
69. M. Vagues, Analysing backside chipping issues of the die at wafer saw., San Jose State University, San Jose, CA, 2003, retrieved November 23, 2011, http://www.sjsu.edu/faculty/selvaduray/page/papers/mate234/martinvagues.pdf
70. U. Efrat, Proceedings of the 15th IEEE/CHMT International Electronic Manufacturing Technology (IEMT) Symposium, 1993, p. 245.
71. I. Weisshaus, D. Shi and U. Efrat, Adv. Packag. 9, 60 (2000).
72. G. Levinson, Process optimization of dicing microelectronic substrates., Advanced Dicing Technologies Report, retrieved November 23, 2011, http://www.adt-co.com/ADT/Templates/showpage.asp?DBID=1LNGID=1TMID=111FID=900
73. T. Miwa and I. Inasaki, Proceedings of the International Conference on Precision Engineering, 2007, p. 397.
74. S. Y. Luo and Z. W. Wang, Int. J. Adv. Manuf. Technol. 35, 1206 (2008). 10.1007/s00170-006-0800-3
75. U. Efrat, Chip Scale Rev. 10, 65 (2006).
76. C. Paydenkar, A. Poddar, and H. Chandra, Proceedings of the IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium, 2004, p. 74.
77. Military Standard MIL-STD-883G, METHOD 2010.11, Internal Visual (Monolithic)..
78. J. V. Otero, M. L. Roque, R. A. Rolda, Jr., and G. R. Nunag, Establishing wafer saw process for 62 microns scribe street., Presented at the 14th Association of Semiconductor and Electronics Manufacturing Engineers of the Philippines (ASEMEP) National Technical Symposium, Manila, Philippines, 17-18 June 2004.
79. J. H. Luo, T. Li, and J. Z. Yao, Proceedings of the 10th Electronic Packaging Technology Conference, 2008, p. 1253.
80. D. W. C. Way and L. C. Ying, High speed wafer dicing with ablation laser cut., Presented at the 33rd IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium, Penang, Malaysia, 4-6 November 2008.
81. W. Kroeninger and F. Mariani, Proceedings of the 56th Electronic Component Technology Conference, 2006, p. 1317.
82. H. Theuss, A. Koller, W. Kroeninger, S. Schoenfelder, and M. Petzold, Proceedings of the 58th Electronic Component Technology Conference (ECTC), 2008, p. 1525.
83. D. H. Kim, Y. J. Kim, K. S. Seong, J. K. Song, B. C. Kim, C. H. Hwang, and C. H. Lee, Proceedings of the 59th Electronic Component Technology Conference, 2009, p. 1531.
84. Z. Ball and R. Sauerbrey, Appl. Phys. Lett. 65, 391 (1994). 10.1063/1.112342
85. H. X. Zhao and D. Shi, Proceedings of the IEEE/CPMT/SEMI 28th International Electronic Manufacturing Technology (IEMT) Symposium, 2003, p. 401.
86. Z. J. Wang, J. H. Wang, S. Lee, S. Y. Yao, R. Han, and Y. Q. Su, IEEE Trans. Electron. Packag. Manuf. 30, 313 (2007). 10.1109/TEPM.2007.906488
87. K. W. Shi, K. Y. Yow, and R. Khoo, Proceedings of the 34th IEEE/CPMT International Electronic Manufacturing Technology (IEMT), 2010, p. 1.
88. J. A. Fitzsimmon, M. W. Lane, V. J. McGahay, T. M. Shaw, and A. K. Stamper, U.S. patent 7,109,093 B2 (19 September 2006).
89. W. F. Lamders, T. M. Shaw, D. Llera-Hurlburt, S. W. Crowder, V. J. McGahay, S. G. Malhotra, C. R. Davis, R. D. Goldblatt, and B. H. Engel, U.S. patent 7,098,676 B2 (29 August 2006).
90. D. C. Edelstein and L. M. Nicholson, U.S. patent 7,098,544 B2 (29 August 2006).
91. T. L. Lee, S.-C. Chen, M.-S. Liang, and C.-H. Yu, U.S. patent 6,876,062 B2 (5 April 2005).
92. T. H. Daubenspeck, J. P. Gambino, T. L. McDevitt, and A. K. Stamper, U.S. patent 6,833,720 B1 (21 December 2004).
93. J. H. Li, H. Hwang, E.-C. Ahn, Q. Chen, and P. W. Kim, Proceedings of 57th Electronic Components Technology Conference (ECTC), 2007, p. 761.
94. S. Takyu, T. Kurosawa, N. Shimizu, and S. Harada, Proceedings of the 56th Electronic Components Technology Conference (ECTC), 2006, p. 1623.
95. B. Yeung and T. Lee, IEEE Trans. Compon. Packag. Technol. 26, 423 (2003). 10.1109/TCAPT.2003.815111
96. G. de With and H. H. M. Wagemens, J. Am. Ceram. Soc. 72, 1538 (1989). 10.1111/j.1151-2916.1989.tb07702.x
97. S. Schoenfelder, M. Ebert, C. Landesberger, and K. Bock, Microelectron. Reliab. 47, 168 (2007). 10.1016/j.microrel.2006.09.002
98. S.-H. Chae, J. -H. Zhao, D. R. Edwards, and P. S. Ho, IEEE Trans. Device Mater. Reliab. 10, 149 (2010). 10.1109/TDMR.2009.2037141
99. SEMI G86-0303 Standard, Test Method for Measurement of Chip (Die) Strength by Means of 3-Point Bending., 2003.
100. S. Schoenfelder, J. Bagdahn, and M. Petzold, in Ultra-thin Chip Technology and Applications, 1st ed., edited by, J. N. Burghartz, (Springer-Verlag, New York, 2011), Chap., pp. 201-208.
101. W. Weibull, Proc. R. Swed. Inst. Eng. Res. 151, 5 (1939).
102. A. Kiss, T. Hoang, C. Harendt, and J. N. Burghartz, Proceedings of the Annual Workshop on Semiconductors and Advanced Future Electronic Sensors (SAFE), 2009, p. 85.
103. W.-S. Lei, Statistics of Brittle Fracture under Multiaxial Loading (Shaker Verlag, Aachen, Germany, 1999), p. 41.
104. D. Y. R. Chong, W. E. Lee, B. K. Lim, J. H. L. Pang, and T. H. Low, Proceedings of the IEEE/CPMT 9th Intersociety Conference on Thermal Thermomechanical Phenomena in Electronic Systems, 2004, p. 203.
105. C. H. Chen, M. Y. Tsai, J. Y. Tang, W. L. Tsai, and T. J. Chen, Proceedings of the International Conference on Electronic Material Packaging, 2007, p. 6.
106. M. Y. Tsai and C. S. Lin, Proceedings of the 55th Electronic Components Technology Conference, 2005, Vol. 2, p. 1155.
107. C. R. Cook, Jr., U.S. patent 4,096,619 (27 June 1978).
108. H.-W. Chen and C.-Y. Chang, U.S. patent 6,214,703 B1 (10 April 2001).
109. J. P. Almerico, P. F. Werbaneth, and Y. K. Cho, III-Vs Rev. 15, 48 (2002). 10.1016/S0961-1290(02)85187-0
110. H. C. Rafla-Yuan and R. Bradley, U.S. patent 5,961,852 (5 October 1999).
111. J.-K. Park and J. Welborn, Ind. Laser Solutions 20, 18 (2005).
112. H. C. Chou, A novel backside process to achieve 1-mil thick wafers at 6-inch founder., Presented at the International Conference on Compound Semiconductor Manufacturing Technology, Scottsdale, AZ, 19-22 May 2003.
113. J. Chou, C.-H. Hua, S. Yang, and P.-W. Chen, Reducing chipping defects during GaAs wafer dicing with a four-point diamond tool., Presented at the International Conference on Compound Semiconductor Manufacturing Technology, Chicago, IL, 14-17 April 2008.
114. M. Mendes, J. Fu, C. Porneala, X.-Y. Song, M. Hannon, and J. P. Sercel, Proc. SPIE 7584, 75840T-1 (2010). 10.1117/12.843815
115. M. Cooke, III-Vs Rev. 19, 20 (2006). 10.1016/S0961-1290(06)71638-6
116. D. Scannell and D. Smith, Microelectron. Manuf. Test. 11, 10 (1988).
117. K. Wasmer, C. Ballif, C. Pouvreau, D. Schulz, and J. Michler, J. Mater. Process. Technol. 198, 114 (2008). 10.1016/j.jmatprotec.2007.06.055
118. K. Wasmer, C. Ballif, C. Pouvreau, D. Schulz, and J. Michler, J. Mater. Process. Technol. 198, 105 (2008). 10.1016/j.jmatprotec.2007.06.054
119. K. Wasmer, Adv. Eng. Mater. 7, 309 (2005). 10.1002/adem.200500044
120. M. S. Acker, Adv. Packag. 10, 11 (2001).
121. P. Ogawa, D. Perrottet, F. Wagner, R. Housh, and B. Richerzhagen, Chipping-free dicing of III/V semiconductor materials with the water jet guided laser., Presented at the 5th International Symposium on Laser Precision Microfabrication, Nara, Japan, 11-14 May 2004.
122. E. Y. Chang, R. Dean, J. Proctor, R. Elmer, and K. Pande, IEEE Trans. Semicond. Manuf. 4, 66 (1991). 10.1109/66.75855
123. G. Michot, Cryst. Properties Prep. 17/18, 55 (1988).
124. R. Pérez and P. Gumbsch, Phys. Rev. Lett. 84, 5347 (2000). 10.1103/PhysRevLett.84.5347
125. J. E. Ayers, Heteroepitaxy of Semiconductors: Theory, Growth, and Characterization (CRC Press, Boca Raton, FL, 2007), pp. 14,15.
126. D. Sherman and I. Be'ery, J. Mech. Phys. Solids 52, 1743 (2004). 10.1016/j.jmps.2004.02.004
127. H. H. Jiun, I. Ahmad, A. Jalar, and G. Omar, IEEE Trans. Electron. Packag. Manuf. 29, 17 (2006). 10.1109/TEPM.2005.862625
128. J. H. Liu, Z. J. Pei, and G. R. Fisher, Int. J. Mach. Tool. Manuf. 47, 1 (2007). 10.1016/j.ijmachtools.2006.02.003
129. H. Lundt, M. Kerstan, A. Huber, and P. O. Hahn, Proceedings of the 7th International Symposium on Silicon Materials Science and Technology, 1994, Vol. 94-10, p. 218.
130. Z. J. Pei, S. R. Billingsley, and S. Miura, Int. J. Mach. Tool. Manuf. 39, 1103 (1999). 10.1016/S0890-6955(98)00079-0
131. B. Lawn and R. Wilshaw, J. Mater. Sci. 10, 2016 (1975). 10.1007/BF00557479
132. R. W. Armstrong, A. W. Ruff, and H. Shin, Mater. Sci. Eng. A 209, 91 (1996). 10.1016/0921-5093(95)10148-9
133. A. Misra and I. Fininie, J. Mater. Sci. 14, 2567 (1979). 10.1007/BF00610624
134. U. Efrat and I. Weisshaus, Dicing yield-Using blade torque to monitor chipping., Presented at SEMICON Singapore Test, Assembly and Packaging (TAP) Technical Program, Singapore, 4-6 May 1999.
135. I. Weisshaus and O. Y. Licht, U.S. patent 6,033,288 (7 March 2000).
136. I. Weisshaus and O. Y. Licht, U.S. patent 6,168,500 B1 (2 January 2001).
137. J. Jiang, C. L. Song, and Z. L. Zhang, Proceedings of the 5th International Conference on Electronic Packaging Technology, 2003, p. 130.
138. T. M. Shaw, E. Liniger, G. Bonilla, J. P. Doyle, B. Herbst, X. H. Liu, and M. W. Lane, Proceedings of the IEEE International Interconnect Technology Conference, 2007, p. 114.
139. D. H. Eppes, U.S. patent 7,091,621 B1 (15 October 2006).
140. R. Chaware and L. Hoang, Proceedings of the IEEE Electronic Packaging Technology Conference, 2006, p. 622.
141. L. R. Clark, M. Brown, S. Evans, S. Bedore, C. E. Gutentag, and R. A. Sirra, in Area Array Interconnection Handbook, edited by, K. Puttlitz, and, P. A. Totta, (Kluwer Academic Publishers, Nowell, MA, 2001), Chap., pp. 201-227.
142. T. Ono, U.S. patent 4,688,540 (25 August 1987).
143. K. W. Shi, K. Y. Yow, K. Rachel, and C. Lo, Proceedings of the 11th Electronic Packaging Technology Conference, 2009, p. 889.
144. H. H. Gatzen and G. Guenzel, Dicing of Ultra-thin Silicon Wafers., Presented at the 17th ASPE Annual Meeting, St. Louis, MO, 20-25 October 2002.
145. T. Kimura and T. Kato, U.S. patent 4,722,130 (2 February 1988).
146. C. Landesberger, S. Scherbaum, and K. Bock, in Ultra-thin Chip Technology and Applications, 1st ed., edited by, J. N. Burghartz, (Springer, New York, 2011), Chap., pp. 33-43.
147. C. Landesberger, G. Klink, G. Schwinn, and R. Aschenbrenner, Proceedings of the International Symposium and Exhibition of Advanced Packaging Materials, 2001, p. 92.
148. M. Feil, C. Landesberger, A. Klumpp, and E. Hacker, U.S. patent 6,756,288 B1 (29 June 2004).
149. S. Sasaki, S. Takyu, K. Tokubuchi, and K. Yazima, U.S. patent 5,888,883 (30 March 1999).
150. C. Hendricks, E. Woolsey, and J. Murphy, U.S. patent 7,655,539 B2 (2 February 2010).
151. T. Lieberenz and D. Martin, Chip Scale Rev. 10, 51 (2006).
152. G. Klug, Advanced solutions for ultra-thin wafers and packaging., Presented at the European Microelectronics Packaging Conference, Rimini, Italy, 15-18 June 2009.
153. A. J. Riding, W. H. Jones, and L. Pennisi, U.S. patent 6,083,811 (4 July 2000).
154. K. Arai, M. Takeuchi, H. Hayashi, and H. Sando, U.S. patent 6,676,491 B2 (13 January 2004).
155. S. W. Park and H. J. Park, U.S. patent 7,074,695 B2 (11 July 2006).
156. K. Takahashi, K. Ebe, and S. Takyu, U.S patent 6,465,330 B1 (15 October 2002).
157. T. Sugino and H. Senoo, U.S. patent 6,656,819 B1 (2 December 2003).
158. S.-I. Denda, Adv. Microelectron. 33, 28 (2006).
159. S. Takyu, M. Kiritani, T. Kurosawa, and N. Shimizu, The development of cleaving - DBG CMP process., Presented at the IEEE CPMT Symposium, Tokyo, Japan, 24-26 August 2010.
160. S. L. Chen, T.-Y. Kuo, H.-T. Hu, J.-R. Lin, and S.-P. Yu, Proceedings of the 55th Electronic Components Technology Conference, 2005, Vol. 2, 1526.
161. W. J. Kroninger, F. Hecht, G. Lang, F. Mariani, S. Geyer, and L. Schneider, in Proceedings of the 51th Electronic Components Technology Conference, 2001, p. 1029.
162. S. Takyu, J. Sagara, and T. Kurosawa, Proceedings of the 58th Electronic Components Technology Conference, 2008, p. 1511.
163. K. Kobayashi, Challenges for 3D interconnect., Presented at the Sematech Summer Conference on Equipment Challenges for 3D Interconnect, San Francisco, CA, July 16, 2008
164. B. N. Chichkov, C. Momma, S. Nolte, F. von Alvensleben, and A. Tuennermann, Appl. Phys. A 63, 109 (1996). 10.1007/BF01567637
165. N. Bityurin, B. S. Luk'yanchuk, M. H. Hong, and T. C. Chong, Chem. Rev. 103, 519 (2003). 10.1021/cr010426b
166. G. Raciukaitis and M. Gedvilas, Proceedings of the International Conference on Applied Lasers and Electro-Optics (ICALEO), 2005, p. 191.
167. W. Zhang, Y. L. Yao, and K. Chen, Int. J. Adv. Manuf. Technol. 18, 323 (2001). 10.1007/s001700170056
168. F. Siegel, U. Klug, and R. Kling, J. Laser Micro/Nanoeng. 4, 104 (2009). 10.2961/jlmn.2009.02.0006
169. D. Karnakis, Appl. Surf. Sci. 252, 7823 (2006). 10.1016/j.apsusc.2005.09. 040
170. D. Karnakis, G. Rutterford, and M. R. H. Knowles, Proceedings of the International Conference on Applied Lasers and Electro-Optics (ICALEO), 2005, p. 34.
171. F. Brandi, N. Burdet, R. Carzino, and A. Diaspr, Opt. Express 18, 23488 (2010). 10.1364/OE.18.023488
172. R. Le Harzic, D. Breitling, M. Weikert, S. Sommer, C. Foehl, S. Valette, C. Donnet, E. Audouard, and F. Dausinger, Appl. Surf. Sci. 249, 322 (2005). 10.1016/j.apsusc.2004.12.027
173. J. Krüger and W. Kautek, Laser Phys. 9, 30 (1999).
174. M. Meunier, B. Fisette, A. Houle, A. V. Kabashin, S. V. Broude, and P. Miller, Proc. SPIE 4978, 169 (2003). 10.1117/12.478595
175. A. Ostendorf, C. Kulik, T. Bauer, and N. Baersch, Proc. SPIE 5340, 153 (2004). 10.1117/12.530692
176. D. Breitling, A. Ruf, and F. Dausinger, Proc. SPIE 5339, 49 (2004). 10.1117/12.541434
177. A. Miotello and R. Kelly, Appl. Phys. Lett. 67, 3535 (1995). 10.1063/1.114912
178. H. Ki, P. S. Mohanty, and J. Mazumder, J. Phys. D 34, 364 (2001). 10.1088/0022-3727/34/3/320
179. J. Ren, S. S. Orlov, L. Hesselink, H Howard, and A. Conneely, Proc. SPIE 5339, 382 (2004). 10.1117/12.529442
180. Q. M. Lu, S. S. Mao, X. L. Mao, and R. E. Russo, J. Appl. Phys. 104, 083301-1 (2008). 10.1063/1.2978369
181. J. H. Yoo, S. H. Jeong, R. Greif, and R. E. Russo, J. Appl. Phys. 88, 1638 (2000). 10.1063/1.373865
182. D. J. Lim, H. S. Ki, and J. Mazumder, J. Phys. D 39, 2624 (2006). 10.1088/0022-3727/39/12/023
183. K. Venkatakrishnan, N. Sudani, and B. Tan, J. Micromech. Microeng. 18, 075032-1 (2008). 10.1088/0960-1317/18/7/075032
184. D. J. Li, S. J. Fu, X. M. Liu, P. Shi, J. Chen, A. Shell, B. S. Qi, C.-R. Haas, J. X. Wang, and K. M. Du, Proc. SPIE 7578, 75780N-1 (2010). 10.1117/12.847309
185. J. M. Bovatsek and R. J. Patel, Proc. SPIE 7578, 7578K-1 (2010). 10.1117/12.845298
186. L. K. Shiuann, Proc. Int. Electron. Manuf. Technol. (IEMT) 31, 506 (2006).
187. M. H. Hong, Q. Xie, K. S. Tiaw, and T. C. Chong, J. Laser Micro/Nanoeng. 1, 84 (2006). 10.2961/jlmn.2006.01.0016
188. G. Overton, Laser Focus World 46, 26 (2010).
189. K. Dunne, C. Cillian, and O. Fallon, U.S. patent 7,947,575 B2 (24 May 2011).
190. A. Boyle, D. Gillen, K. Dunne, E. F. Gomez, and R. Toftness, European patent No. EP 1 825 507 B1 (28 September 2011).
191. D. Perrottet, K. Dunne, G. Walsh, and B. Diggin, Adv. Packag. 17, 35 (2008).
192. K. Pettigrew, M. Knowles, and M. Smith, Chip Scale Rev. 15, 22 (2011).
193. R. Evertsen and R. Hendriks, Backside processing steps elimination and cost reduction by multi beam full cut laser dicing., Presented at Compound Semiconductor Manufacturing Technology Conference, Palm Springs, CA, 16-19 May 2011.
194. J. C. E. Broekroelofs, U.S. patent 5,922,224 (13 July 1999).
195. J. van Borkulo, R. Evertsen, and R. Hendriks, Proceedings of the China Semiconductor Technology International Conference, 2009, Vol. 18, 837.
196. J. van Borkulo and R. Hendriks, Proc. China Semicond. Technol. Int. Conf. 34, 873 (2011) 10.1149/1.3096543.
197. J. van Borkulo and P. H. Chall, U.S. patent 7,947,920 B2 (24 November 2011).
198. R. Evertsen and P. H. Chall, U.S. patent 7,682,937 B2 (23 March 2010).
199. R. Hendriks, J. van Borkulo, and M. Mueller, Paradigm shift in compound semiconductor production since the introduction of laser dicing., Presented at Compound Semiconductor Manufacturing Technology Conference, Tampa, FL., 18-21 May 2009.
200. M. C. Müller, R. Hendriks, and H. P. Chall, Proceedings of the Compound Semiconductor Manufacturing Technology Conference, 2006, p. 141.
201. T. A. Abshere, M. Minkoff, and B. Howell, Proceedings of the Compound Semiconductor Manufacturing Technology Conference, 2008, p. 69.
202. W.-S. Lei, R. Yalamanchili, and A. Kumar, Advanced wafer dicing., Applied Materials Technical Report, Applied Materials, Inc., November, 2010.
203. B. Richerzhagen, G. P. Delacretaz, and R.-P. Salathe, Opt. Eng. 35, 2058 (1996). 10.1117/1.600995
204. B. Richerzhagen, U.S. patent 5,902,499 (11 May 1999).
205. B. Richerzhagen, U.S. patent No. 7,163,875 B2 (16 January 2007).
206. B. Richerzhagen and A. Spiegel, U.S. patent 7,728,258 B2 (1 June 2010).
207. S. A. Synova, Water jet guided laser., retrieved November 23, 2011, http://www.synova.ch/pdf/
208. B. Richerzhagen, The water jet guided laser and its applications., retrieved November 23, 2011, http://www.synova.ch/pdf/
209. A. Spiegel, N. Vago, and F. R. Wagner, Opt. Eng. 43, 450 (2004). 10.1117/1.1634292
210. P. Couty, F. Wagner, and P. Hoffmann, Opt. Eng. 44, 068001-1 (2005). 10.1117/1.1928280
211. T. A. Mai, B. Richerzhagen, and K. Stay, Fundamental and beam propagation behaviour of a microjet and recent applications using laser MicroJet® technology., Presented at the 8th International Symposium on Laser Precision Microfabrication, Vienna, Austria, 24-28 April 2007.
212. B. Richerzhagen, R. Housh, and F. Wagner, Proceedings of the Advanced Laser Application Conference and Exposition (ALAC), 2004, Vol. 2, p. 175.
213. N. Vágó, Á. Spiegel, P. Couty, F. R. Wagner, and B. Richerzhagen, Exp. Fluids 35, 303 (2003). 10.1007/s00348-003-0631-z
214. P. Couty, Á. Spiegel, N. Vágó, I. Ugurtas, and P. Hoffmann, Exp. Fluids 36, 919 (2004). 10.1007/s00348-003-0775-x
215. D. Perrottet, S. Green, and B. Richerzhagen, Proceedings of the 17th Annual SEMI/IEEE Advanced Semiconductor Manufacturing Conference, 2006, p. 233.
216. A. Pauchard, K. Lee, N. Vago, M. Pavius, and S. Obi, Proc. SPIE 7201, 72010A-1 (2009). 10.1117/12.814712
217. A. Pauchard, N. Vago, and B. Richerzhagen, Proceedings of the 3rd Pacific International Conference on Applied Laser Optics (PICALAO), 2008, p. M404.
218. J. Kaspar, A. Luft, S. Nolte, M. Will, and E. Beyer, J. Laser Appl. 18, 85 (2006). 10.2351/1.2164480
219. K. Shimizu and K. Takahashi, J. Laser Appl. 18, 127 (2006). 10.2351/1.2193178
220. W. kroeinger, D. Perrottet, J.-M. Buchilly, and B. Richerzhagen, Semicond. Int. 28, 4 (2005).
221. D. Perrottet, R. Housh, B. Richerzhagen, and J. Manley, Proc. SPIE 5713, 285 (2005). 10.1117/12.586710
222. S. Schoenfelder, J. Bagdahn, S. Baumann, D. Kray, K. Mayer, G. Willeke, M. Becker, and S. Christiansen, Strength characterization of laser diced silicon for application in solar industry., Presented at the 21st European Photovoltaic Solar Energy Conference and Exhibition, Dresden, Germany, 4-8 September 2006.
223. N. Dushkina, F. R. Wagner, C. Boillat, J.-M. Buchilly, and B. Richerzhagen, Proc. SPIE 4977, 75 (2003). 10.1117/12.479414
224. D. Perrottet, J.-M. Buchilly, B. Richerzhagen, and W. Kröninger, Future Fab. Int. 18, 157 (2005).
225. A. Pauchard, High power applications of the laser microjet., retrieved November 23, 2011, http://www.swisslaser.net/libraries.files/SwissLaserNet-11. 09.pdf
226. S. Prahl, Optical absorption of water., retrieved November 23, 2011, http://omlc.ogi.edu/spectra/water/index.html
227. M. Chaplin, Water Absorption Spectrum., retrieved November 23, 2011, http://www.btinternet.com/~martin.chaplin/vibrat.html
228. J. Vittu, D. Perrottet, J.-M. Buchilly, and B. Richerzhagen, Future Fab Int. 17, 151 (2004).
229. W. Evers, A. Issaris, Y. Mitsuoka, E. Thys, and Y. Akada, U.S. patent 7,608,328 B2 (27 October 2009).
230. D. Kray, S. Baumann, K. Mayer, A. Eyer, and G. P. Willeke, Novel techniques for low-damage microstructuring of silicon., Presented at 20th European Photovoltaic Solar Energy Conference and Exhibition, Barcelona, Spain, 6-10 June 2005.
231. D. Kray, A. Fell, S. Hopman, K. Mayer, G. P. Willeke, and S. W. Glunz, Appl. Phys. A 93, 99 (2008). 10.1007/s00339-008-4723-8
232. S. Hopman, A. Fell, K. Mayer, M. Mesec, A. Rodofili, and D. Kray, Appl. Phys. A 95, 857 (2009). 10.1007/s00339-009-5087-4
233. S. Hopman, A. Fell, K. Mayer, A. Rodofili, and F. Granek, Proc. SPIE 7585, 75850S-1 (2010) 10.1117/12.841340.
234. O. Haupt, F. Siegel, A. Schoonderbeek, L. Richter, R. Kling, and A. Ostendorf, J. Laser Micro/Nanoeng. 3, 135 (2008). 10.2961/jlmn.2008.03.0002
235. N. Sudani, K. Venkatakrishnan, and B. Tan, Opt. Laser. Eng. 47, 850 (2009). 10.1016/j.optlaseng.2009.01.009
236. K. Venkatakrishnan and B. Tan, J. Micromech. Microeng. 17, 2505 (2007). 10.1088/0960-1317/17/12/017
237. L. Shah, K. Monro, and G. C. Cho, Laser Focus World 44, 61 (2008).
238. T. A. Mai, Ind. Laser Solution 23, 16 (2008).
239. H. Ishida, U.S. patent 6,117,347 (12 September 2000).
240. R. Manor, U.S. patent 6,420,245 B1 (16 July 2002).
241. J. A. Maiz, U.S. patent 6,596,562 B1 (22 July 2003).
242. S. W. Lu, H.-H. Lee, M.-C. Sung, and M.-J. Lii, U.S. patent 7,265,034 B2 (4 September 2007).
243. S. W. Lu, H.-H. Lee, M.-C. Sung, and M.-J. Lii, U.S. patent 7,642,631 B2 (5 January 2010).
244. N. C. Peng, K. S. Tan, C. B. Chye, T. H. Chuan, and F. C. Wai, U.S. patent 6,737,606 B2 (18 May 2004).
245. R. Starkston, A. Proctor, and S. Terry, U.S. Patent 7,772,090 B2 (10 August 2010).
246. A. E. Hooper, D. Barsic, R. Vandergiessen, H. B. Zhang, and J. N. O'Brien, U.S. patent 7,977,213 B1 (12 July 2011).
247. T.A. Mai, R. Housh, B. Richerzhagen, K. Stay, and M. Plankensteiner, Fusion of diamond blade saw with water jet-guided laser technology to yield revolutionary dicing solution., Presented at SEMICON Europa Advanced Packaging Conference, Stuttgart, Germany, 9-11 October 2007.
248. B. Richerzhagen, M. Plankensteiner, N. U. Kling, and K. Stay, Proc. SPIE 6880, 688005-1 (2008). 10.1117/12.760357
249. K. M. Du and P. Shi, Glass Sci. Technol. 76, 95 (2003).
250. K. C. Chen, Y. K. Su, C.-L. Lin, and H. C. Hsu, J. Lightwave Technol. 29, 1907 (2011). 10.1109/JLT.2011.2140091
251. T. A. Friedmann, B. Jared, and B. Sweatt, Sandia National Laboratories Report No. SAND2011-2057, 2011.
252. Hamamatsu Photonics K. K., Stealth dicing technology and applications., March 2005, retrieved November 23, 2011, http://jp.hamamatsu.com/resources/ products/etd/pdf/SD-tech-TLAS9004E01.pdf
253. Hamamatsu Photonics K. K., Stealth dicing technical information for MEMS., retrieved November 23, 2011, http://jp.hamamatsu.com/resources/products/ etd/pdf/SD-tech-forMEMS-TLAS9005E01.pdf
254. M. Kumagai, N. Uchiyama, E. Ohmura, R. Sugiura, K. Atsumi, and K. Fukumitsu, IEEE Trans. Semicond. Manuf. 20, 259 (2007). 10.1109/TSM.2007.901849
255. F. Fukuyo, K. Fukumitsu, N. Uchiyama, and T. Wakuda, U. S patent 6,992,026 B2 (31 January 2006).
256. K. Fukumitsu, U.S. patent 7,605,344 B2 (20 October 2009).
257. Y. Fujii, F. Fukuyo, K. Fukumitsu, and N. Uchiyama, U.S. patent 7,566,635 B2 (28 July 2009).
258. F. Fukuyo, K. Fukumitsu, N. Uchiyama, T. Wakuda, K. Atsumi, and K. Muramatsu, U.S. patent 7,547,613 B2 (16 June 2009).
259. F. Fukuyo, K. Fukumitsu, N. Uchiyama, T. Wakuda, K. Atsumi, and K. Muramatsu, U.S. patent 7,592,238 B2 (22 September 2009).
260. F. Fukuyo, K. Fukumitsu, N. Uchiyama, T. Wakuda, K. Atsumi, and K. Muramatsu, U.S. patent 7,626,137 B2 (1 December 2009).
261. F. Fukuyo, K. Fukumitsu, N. Uchiyama, T. Wakuda, K. Atsumi, and K. Muramatsu, U.S. patent No. 7,615,721 B2 (10 November 2009).
262. F. Fukuyo, K. Fukumitsu, N. Uchiyama, and T. Wakuda, U.S. patent 7,732,730 B2 (8 June 2010).
263. F. Fukuyo, K. Fukumitsu, N. Uchiyama, and T. Wakuda, U.S. patent 7,825,350 B2 (2 November 2010).
264. F. Fukuyo, K. Fukumitsu, N. Uchiyama, and T. Wakuda, U.S. patent 7,396,742 B2 (8 July 2008).
265. F. Fukuyo, K. Fukumitsu, and T. Osajima, U.S. patent 7,489,454 B2 (10 February 2009).
266. F. Fukuyo and K. Fukumitsu, U.S. patent No. 7,749,867 B2 (6 July 2010).
267. E. Ohmura, F. Fukuyo, K. Fukumitsu, and H. Morita, J. Achiev. Mater. Manuf. Eng. 17, 381 (2006).
268. E. Ohmura, M. Kumagai, M. Nakano, K. Kuno, K. Fukumitsu, and H. Morita, J. Adv. Mech. Des. Syst. Manuf. 2, 540 (2008) 10.1299/jamdsm.2.540.
269. M. Kumagai, T. Sakamoto, and E. Ohmura, Proceedings of the International Symposium on Semicondor Manufacturing (ISSM), PT-O-086, 2007.
270. P. Lange, N. Marenco, S. Gruenzig, S. Warnat, and T. Semperowitsch, Mater. Res. Soc. Symp. Proc. 1139, 1139-GG01-09 (2009). 10.1557/PROC-1139-GG01- 09
271. M. Birkholz, K.-E. Ehwald, M. Kaynak, T. Semperowitsch, B. Holz, and S. Nordhoff, J. Optoelectron. Adv. Mater. 12, 479 (2010).
272. F. Lewis, P. Wright, D. Martin, S. Michel, and L. Ouellet, Dicing of sensitive MEMS devices: Challenges and solutions., Presented at Sensors Expo and Conference, Rosemont, IL, 6-7 June 2011.
273. F. Mariani, W. Kroenginger, A. Koller, H. Theuss, and J. Arkenau, U.S. patent 8,017,942 B2 (13 September 2011).
274. Y. Shizuno, U.S. patent 7,566,638 B2 (28 July 2009).
275. MEMS Land, ALSI laser dicing., retrieved November 23, 2011, http://www.memsland.nl/publications/Publications202007/ 200720ALSI20MEMSland20Participation.pdf
276. C. Miyazaki, H. Shimamoto, T. Uematsu, and Y. Abe, Development of wafer thinning and dicing technology for thin wafer., Presented at the International Conference on 3D System Integration (3D IC), San Francisco, CA, 28-30 September 2009.
277. A. L. Hartzell, M. G. da Silva, and H. R. Shea, MEMS Reliability (Springer, Berlin, 2011), p. 78.
278. V. S. Kondratenko, U.S. patent 5,609,284 (11 March 1997).
279. B. Hoekstra, R. Flanningan, and D. Wegerif, U.S. patent 6,660,963 B2 (9 December 2003).
280. H. Ostendarp, C. Hermanns, D. Hauer, J. Stein, G. Geissler, R. Steinfartz, B. Hoetzel, and A. Blunck, U.S. patent 5,984,159 (16 November 1999).
281. G. V. Shepelov, I. N. Shiganov, and I. E. Malov, J. Weld. Int. 14, 988 (2000).
282. A. Ostendorf, U. Stute, and C. Büsching, Cutting of flat glass and laminated glass by solid-state lasers., Presented at Glass Processing Days, Tampere, Finland, 17-20 June 2005.
283. H.-U. Zuehlke, J. Grieger, and G. Eberhardt, U.S. patent 7,816,626 B2 (19 October 2010).
284. H.-U. Zuehlke, G. Eberhardt, and R. Ullmann, TLS-Dicing: A new wafer dicing technology for higher yield and throughput., Presented at the European-Russian Semiconductor Technology Conference on Networking, Moscow, Russia, 4 June 2009.
285. H.-U. Zuhlke, G. Eberhardt, and R. Ullmann, Proceedings of the IEEE/SEMI Advanced Semiconductor Manufacturers Conference, 2009, p. 28.
286. O. Haupt, V. Schuetz, A. Schoonderbeek, L. Richter, and R. Kling, Proc. SPIE 7202, 72020G-1 (2009) 10.1117/12.810053.
287. R. Takeda, T. Ueda, T. Furumoto, A. Hosokawa, and R. Tanaka, Proceedings of the International Conference on Leading Edge Manufacturing in the 21st Century (LEM21), 2009, p. 589.
288. A. Harikai, K. Arita, and T. Iwai, U.S. patent 7,994,026 B2 (9 August 2011).
289. K. Arita, SUSS Report, Issue 1, 2010, p. 4.
290. K. Arita and A. Harikai, U.S. patent 7,906,410 B2 (15 March 2011)
291. B. Wu, A. Kumar, and S. Pamarthy, J. Appl. Phys. 108, 051101-1 (2010). 10.1063/1.3474652
292. A. Kumar, Wafer dicing for advanced packaging., Applied Materials Technical Report, Applied Materials, Inc., June 2007.
293. S. Sandireddy and T. Jiang, Proceedings of the IEEE Workshop on Microelectronic Electron Devices, 2005, p. 24.
294. L. Wu, J. Chan, and C. S. Hsiao, Proceedings of the 53th Electronic Components Technology Conference, 2003, p. 1463.
295. S. Hosali, G. Smith, L. Smith, S. Vitkavage, and S. Arkalgud, in Wafer Level 3-D ICs Process Technology, edited by, C. S. Tan, R. J. Gutmann, and, L. R. Reif, (Springer, Berlin, 2008), Chap., pp. 95-98.
296. J. Spitzer, Chip Scale Rev. 9, 20 (2005)
297. M. Hacher, Compound Semicond. 14, 23 (2008).
298. P. Heinze, M. Amberger, and T. Chabert, Five-side stress relief-The method to get the Perfect Die', Presented at the SEMICON Europa Advanced Packaging Conference, Stuttgart, Germany, 10-11 October 2007.
299. P. Heinze, M. Amberger, and T. Chabert, Adv. Packag. 17, 14 (2008).