Working temperature characterizations for die attach films in stacked-die process

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2007, Pages 92-95

  Tsai, Tsung Yueh ^a   Chang, Hsiao Chuan ^a   Li, Wei Chung ^a   Teng, Chi Ping ^a   Lai, Yi Shao ^a  

^a ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; HEATING; SEMICONDUCTOR DEVICES; TECHNOLOGY; TEMPERATURE MEASUREMENT; THERMOANALYSIS;

DIE ATTACH; DIE ATTACH PROCESS; DIE PACKAGING; ELECTRONIC DEVICES; ELECTRONICS MANUFACTURING; HEAT SOURCING; PACKAGE RELIABILITY; PROCESS CYCLING; SEMICONDUCTOR ASSEMBLIES; STACK STRUCTURES; STRONG DEMAND; TRANSIENT THERMAL ANALYSIS; WORKING TEMPERATURES;

DIES;

EID: 48149083629     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2007.4417058     Document Type: Conference Paper

References (5)

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4. th Electron. Comp. Technol. Conf., San Diego, CA, USA, pp. 1312-1316, 2006.
5. th Electron. Comp. Technol. Conf., Reno, NV, USA, pp. 1731-1736, 2007.