New dicing and thinning concept improves mechanical reliability of ultra thin silicon

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 92-97

  Landesberger, C ^a   Klink, G ^a   Schwinn, G ^a   Aschenbrenner, R ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

Dicing by Thinning; Fracture tests; Ultra thin chips; Wafer thinning

Indexed keywords

CHIP SCALE PACKAGES; DRY ETCHING; FRACTURE TESTING; INTEGRATED CIRCUIT MANUFACTURE; MICROCRACKS; SAWING; ULTRATHIN FILMS;

ULTRATHIN CHIPS; WAFER THINNING;

SILICON WAFERS;

EID: 0034996841     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)