Time for change in pre-assembly? The challenge of thin chips

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1029-1033

  Kroninger W J ^a   Hecht, F ^a   Lang, G ^a   Mariani, F ^a   Geyer, S ^a   Schneider, L ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUIT MANUFACTURE; POWER ELECTRONICS; SMART CARDS;

CLUSTER TOOLS; HIGH FREQUENCY DEVICES; LOGIC CHIPS; THIN CHIPS;

MICROPROCESSOR CHIPS;

EID: 0034828430     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927939     Document Type: Article

References (4)

1. Crack heeling and fracture strength of silicon crystals