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Volumn , Issue , 2005, Pages 34-41
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High power dpss laser micromachining of silicon, tungsten and stainless steel for device singulation
a,b a a,c |
Author keywords
[No Author keywords available]
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Indexed keywords
ASPECT RATIO;
CUTTING;
DRILLING;
ELECTRONIC EQUIPMENT;
MICROMACHINING;
SILICON;
SOLID STATE LASERS;
STAINLESS STEEL;
TUNGSTEN;
ABLATION MECHANISMS;
MATERIAL PROPERTIES;
MICRODRILLING;
SEMICONDUCTOR LASERS;
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EID: 33645145984
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.2351/1.5060530 Document Type: Conference Paper |
Times cited : (4)
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References (7)
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