Alternative dicing die attach film method for high volume small dice application

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2010, Pages

  Lim, Kf ^a  

^a Advanced Package Development Group   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DIE ATTACH FILM; WAFER SAWING;

INDUSTRIAL ELECTRONICS; MANUFACTURE; SAWING;

DIES;

EID: 79955761089     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2010.5746668     Document Type: Conference Paper

References (4)

1. Annette Teng Cheung, Dicing Die Attach Films for High Volume Stacked Die Application, IEEE Electronics Components and Technology Conference (ECTC), 2006
2. SW Wang & MC Yo, 4 mil DAF Die Thickness Sawing Capability Study, International Electronic Manufacturing Technology (IEMT), 2006
3. Hoy Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar, Alternative Double Pass Dicing Method for Thin Wafer Laminated with Die Attach Film, IEEE, 2004
4. Jonathan Medding, Roland Stalder, Marcel Niederhauser, Patrick Stoessel, Thin Die Bonding Techniques, IEEE/SEMI International Electronic Manufacturing Technology Symposium, 2004