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Volumn 18, Issue 1 PART 2, 2009, Pages 837-842
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Enabling technology in thin wafer dicing
a
a
ALSI
(Netherlands)
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Author keywords
[No Author keywords available]
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Indexed keywords
CONVENTIONAL BLADES;
DICING METHOD;
DICING PROCESS;
DIE ATTACH FILM;
DIE SEPARATION;
ENABLING TECHNOLOGIES;
IC PACKAGING;
LASER DICING;
LOW-K MATERIALS;
MEMORY CAPACITY;
MULTI-BEAM;
MULTI-CHIP;
NON-SILICON;
PERFORMANCE REQUIREMENTS;
THIN WAFER DICING;
THIN WAFERS;
ULTRA-THIN;
DIES;
PACKAGING MATERIALS;
SEMICONDUCTING SILICON COMPOUNDS;
SILICON WAFERS;
TECHNOLOGY;
ELECTRONICS PACKAGING;
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EID: 77950661335
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.3096543 Document Type: Conference Paper |
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Times cited : (6)
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References (0)
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