Comparison of Laser Chemical Processing and LaserMicroJet for structuring and cutting silicon substrates

Applied Physics A: Materials Science and Processing

Volumn 95, Issue 3, 2009, Pages 857-866

  Hopman, Sybille ^a   Fell, Andreas ^a   Mayer, Kuno ^a   Mesec, Matthias ^a   Rodofili, Andreas ^a   Kray, Daniel ^a  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ABLATION EFFICIENCIES; ABLATION PROCESS; CARRIER LIQUIDS; CRYSTALLINE DAMAGES; LASER CHEMICAL PROCESSING; LASER CUTTINGS; LASER SYSTEMS; LASER-INDUCED; LIQUID JETS; LIQUID MEDIAS; MATERIAL REMOVALS; PROCESSING PARAMETERS; SILICON SUBSTRATES; SINGLE LASERS; SURFACE QUALITIES; TARGET PARAMETERS;

CHEMICAL INDUSTRY; CUTTING; JETS; LASER ABLATION; LASER APPLICATIONS; LASER BEAM CUTTING; LIQUID LASERS; LIQUIDS; POTASSIUM; POTASSIUM HYDROXIDE; SEMICONDUCTING SILICON COMPOUNDS;

SILICON WAFERS;

EID: 63849187633     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-009-5087-4     Document Type: Article

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