Wafer sawing process characterization for thin die (75 micron) applications

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 74-77

  Paydenkar, Chetan ^a   Poddar, Anindya ^a   Chandra, Haryanto ^a   Harada, Shigenori ^b  

^a NATIONAL SEMICONDUCTOR CORPORATION   (United States)

^b DISCO HI TEC America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACK-GRINDING EQUIPMENTS; DIE ATTACH FILMS (DAF); WIREBONDING;

CRACK INITIATION; DATA STORAGE EQUIPMENT; ELECTRONICS PACKAGING; HEAT AFFECTED ZONE; SAWING; ULTRAVIOLET RADIATION;

SILICON WAFERS;

EID: 4644364837     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (0)