TLS-Dicing - An innovative alternative to known technologies

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn , Issue , 2009, Pages 28-32

  Zühlke, Hans Ulrich ^a   Eberhardt, Gabriele ^a   Ullmann, Ronny ^a  

^a JENOPTIK Automatisierungstechnik GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BASIC PRINCIPLES; BRITTLE MATERIALS; COST EFFECTIVE; GAAS; LASER TECHNOLOGIES; MECHANICAL FORCE; MECHANICAL SAWING; MINIMAL COST; PROCESS USE; PROTOTYPE SYSTEM; THIN WAFERS; TWO-STEP PROCESS;

BRITTLENESS; LASERS; SEEBECK EFFECT; SEPARATION; SILICON WAFERS; SURVEYING INSTRUMENTS; TECHNOLOGY;

SEMICONDUCTOR LASERS;

EID: 70350227026     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2009.5155947     Document Type: Conference Paper

References (3)

1. Schoenfelder, S.; Ebert, M.; Landesberger, C.; Bock, K., Bagdahn, J.: Investigations of the Influence of Dicing Techniques on the Strength Properties of Thin Silicon, Microelectronics Reliability, 2007, 47, 168-178
2. Ehler, Andreas; Kersten, Michael; Lundt, Holger et. al.: Selected applications of photo thermal and photoluminescence heterodyne techniques for process control in silicon wafer manufacturing. In: Optical Engineering 36(02), 446-458, Brian J. Thompson; Ed.
3. Acker, M.S.: The back-end process: step 11 - scribe and break. In: Advanced packaging, November, 2001