Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 1, 2006, Pages 17-24

  Jiun, Hoh Huey ^a   Ahmad, Ibrahim ^a   Jalar, Azman ^a   Omar, Ghazali ^b  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b Infineon Technologies Malaysia Sdn Bhd   (Malaysia)

Author keywords

Blade overloading; Die attach film; Double pass saw process; Laminated wafer; Lateral crack

Indexed keywords

ATOMIC FORCE MICROSCOPY; CONDUCTIVE FILMS; CRACK PROPAGATION; DIES; ENERGY DISPERSIVE SPECTROSCOPY; LAMINATES; SAWING; SCANNING ELECTRON MICROSCOPY; STRESSES;

BLADE OVERLOADING; CHIPPING CRACK RESISTANCE; DIE-ATTACH FILM;

SILICON WAFERS;

EID: 32144439695     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2005.862625     Document Type: Article

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