Saw + LMJ: A hybrid semiconductor dicing solution

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6880, Issue , 2008, Pages

  Richerzhagen, Bernold ^a   Plankensteiner, Martin ^c   Kling, Notker U ^b   Stay, Keith ^a   Brulé, Arnaud ^a  

^a Synova SA   (Switzerland)

^b Synova USA Inc   (United States)

^c Disco Hi Tech Europe GmbH   (Germany)

Author keywords

Blade saw; Hybrid dicing; Wafer dicing; Water jet guided laser

Indexed keywords

DIAMOND CUTTING TOOLS; MICROMACHINING;

DIAMOND BLADE; HYBRID MACHINE; WAFER DICING;

SEMICONDUCTOR MATERIALS;

EID: 41149130673     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.760357     Document Type: Conference Paper

References (2)

1. Richerzhagen, B. The Best of Both Worlds - Laser and Water Combine in a New Process: The Water Jet Guided Laser, in proceedings ICALEO 2001..
2. Battaglia, J., Perrottet, D., Housh, R., Richerzhagen, B., Synova has re-invented the laser: No heat damage, no beam divergence, no cutting gas, no deposition, Paper M905, ICALEO 2006..