Assessment of a lasersingulation process for Si-wafers with metallized back side and small die size

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1525-1531

  Theuss, H ^a   Koller, A ^a   Kroninger W ^a   Schoenfelder, S ^b   Petzold, M ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER NETWORKS; DIES; SILICON;

DIE SIZE; ELECTRONIC COMPONENTS; METALLIZATION;

SILICON WAFERS;

EID: 51349120739     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550178     Document Type: Conference Paper

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