Thin, strong, cheap

Advanced Packaging

Volumn 17, Issue 6, 2008, Pages 14-18

  Heinze, Peter ^a   Amberger, Martin ^a   Chabert, Therese ^a,b  

^a PVA TEPLA ^*

^b PVA TePla AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DRY ETCHING; ETCHING; HEALTH; IMPACT STRENGTH; INDUSTRIAL ENGINEERING; MECHANICAL PROPERTIES; NONMETALS; PLASMA ETCHING; SEPARATION; SILICON; SILICON WAFERS;

ASSEMBLY PROCESSING; CHIP MANUFACTURING; CHIP QUALITY; DIE STRENGTH; DRY-ETCHING PROCESS; FRONT END; MECHANICAL LOADS; RELATIVE IMPACT; SINGULATION; WAFER SINGULATION;

DIES;

EID: 52649141523     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (8)

1. Kroenninger, W. et al. (2001): The Stability of Silicon Chips. Proceedings of Fraunhofer Gesellschaft FhG workshop. Thin Semiconductor Devices-Manufacturing and Applications 2001, Munich.
2. Heinze. P., Amberger, M., Chabert, T. (2008a): Perfect Chips: Chip-Side-Wall Stress Relief Boosts Stability. Future Fab International #25 (April 2008), p. 111-117.
3. Stephan Schoenfelder, Matthias Ebert, Christof Landesberger, Karlheinz Bock (2006): Investigations of the Influence of Dicing Techniques on the Strength Properties of Thin Silicon. Microelectronics Reliability, May 2006
4. Application Note: CSH, Stress Relief of Thin Chip Sides. PVA TePla, Munich, June 2007.
5. Heinze, P., Amberger, M., Chabert, T. (2007): Five-Side Stress Relief - The method to get the "Perfect Die". Advanced Packaging Conference-October 10-11, 2007 SEMICON Europa 2007 - Stuttgart, Germany.
6. Heinze. P., Amberger, M., Chabert, T. (2008 b): So macht man den Perfekten Chip. Mikroproduction 1/2008, p. 45-50.
7. Heinze. P., Amberger, M., Chabert, T. (2008 c): Thin Chips for 3D-TSV at Ultra-low Cost. Future Fab International #26 (July 2008).
8. Mounier, E. (2007): Trends in 3D Wafer Level Advanced Packaging. Advanced Packaging Conference-October 10-11, 2007 SEMICON Europa2007-Stuttgart, Germany.