High speed wafer dicing with ablation laser cut

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2008, Pages

  Way, David Wong Chee ^a   Ying, Lee Chai ^a  

^a FTZ Group   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

BOND PAD; CONVENTIONAL BLADES; DISCRETE DEVICES; HIGH-SPEED; LASER CUTTING; LASER-CUT; PRE-PRODUCTION; SEMI-CONDUCTOR WAFER; THIN WAFERS; WAFER DIAMETER; WAFER DICING; WAFER TECHNOLOGY;

ABLATION; HEAVY METALS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR LASERS; TECHNOLOGY;

SILICON WAFERS;

EID: 77955108535     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2008.5507855     Document Type: Conference Paper

References (4)

1. Manley, J., Perrottet, D., Wagner, F., Housh, R. and Richerzhagen, B., "High Speed Dicing of GaAs wafers with water-guided laser," Compound Semiconductor Manufacturing Expo, CS-MAX 2004, Monterey, USA, Oct 2004.
2. Perrottet, D., Spiegel, A., Wagner, F. Housh, R., Richerzhagen, B. and Manley, J., "Particle-free Semiconductor Cutting Using the water jet guided laser," Photonic West 2005, San Jose USA. Jan 2005.
3. th International Congress on Laser Advance Materials Processing, Kyoto, Japan, May 2006.
4. Lizotte, T. "Laser Dicing of Chip Scale and Silicon Wafer Scale Packages," Electronic Manufacturing Technology Symposium, July 2003.