Grinding wheels for manufacturing of silicon wafers: A literature review

International Journal of Machine Tools and Manufacture

Volumn 47, Issue 1, 2007, Pages 1-13

  Liu, J H ^a   Pei, Z J ^a   Fisher, Graham R ^b  

^a Sunflower Networking Group   (United States)

^b MEMC Electronic Materials Inc   (United States)

Author keywords

Abrasive; Grinding wheel; Machining; Semiconductor material; Silicon wafer

Indexed keywords

ABRASIVES; POROSITY; SEMICONDUCTOR MATERIALS; SILICON WAFERS;

BOND MATERIALS; GEOMETRY DESIGN; SELF-DRESSING ABILITY;

GRINDING WHEELS;

EID: 33749261104     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2006.02.003     Document Type: Review

References (63)

1. Online Staff, 2004 silicon shipments, revenues rise, Electronic News, 2/9/2005, retrieved from: 〈http://www.reed-electronics.com/electronicnews/article/CA502571〉.
2. Online Staff, 2004 global semi sales hit record high, Electronic News, 1/31/2005, retrieved from: 〈http://www.reed-electronics.com/electronicnews/article/CA500270〉.
3. A. Matsumura, S. Misumi, Y. Hotta, Process of producing semiconductor device and resin composition sheet used therefore, US Patent 0068841, 2003.
4. Liu W.J., Pei Z.J., and Xin X.J. Finite element analysis for grinding and lapping of wire-sawn silicon wafers. Journal of Materials Processing Technology 129 1-3 (2002) 2-9
5. Xin X.J., Pei Z.J., and Liu W.J. Finite element analysis on soft-pad grinding of wire-sawn silicon wafers. Journal of Electronic Packaging 126 2 (2004) 177-185
6. Pei Z.J., and Strasbaugh A. Fine grinding of silicon wafers. International Journal of Machine Tools and Manufacture 41 5 (2001) 659-672
7. R. Vandamme, Y. Xin, Z.J. Pei, Method of processing semiconductor wafers, US Patent 6114245, 2000.
8. S. Chidambaram, Z.J. Pei, Q.X. Yu, Back grinding of semiconductor wafers, Proceedings of International Conference on Progress of Machining Technology, Xi'an, Shanxi, China, September 10-14 (2002) 301-306.
9. Lewis S. Backgrinding wafers for maximum die strength. Semiconductor International 15 8 (1992) 86-89
10. Konnemann G., and Wolf P. Thin grinding of semiconductor materials to 50 μm. Industrial Diamond Review 63 596 (2003) 53-55
11. H. Lundt, M. Kerstan, A. Huber, P.O. Hahn, Subsurface damage of abraded silicon wafers, Proceedings of Seventh International Symposium on Silicon Materials Science and Technology, The Electrochemical Society, Pennington, NJ, Vol. 94-10, (1994) 218-224.
12. Pei Z.J., Billingsley S.R., and Miura S. Grinding induced subsurface cracks in silicon wafers. International Journal of Machine Tools and Manufacture 39 (1999) 1103-1116
13. Funkenbusch P.D., Zhou Y., Takahashi T., and Golini D. Grinding of single crystal sapphire: workpiece roughness correlations. Wear 218 1 (1998) 1-7
14. Hed P.P., and Edwards D.F. Relationship between subsurface damage depth and surface roughness during grinding of optical glass with diamond tools. Applied Optics 26 (1987) 4677-4680
15. Sun W.P., Pei Z.J., and Fisher G.R. Fine grinding of silicon wafers: a mathematical model for the wafer shape. International Journal of Machine Tools and Manufacture 44 7-8 (2004) 707-716
16. Sun W.P., Pei Z.J., and Fisher G.R. Fine grinding of silicon wafers: machine configurations for spindle angle adjustments. International Journal of Machine Tools and Manufacture 45 1 (2005) 51-61
17. Tonshoff H.K., Schmieden W.V., Inasaki I., Konig W., and Spur G. Abrasive machining of silicon. CIRP Annals-Manufacturing Technology 39 2 (1990) 621-630
18. Jackson M.J., Mills B., and Hitchiner M.P. Controlled wear of vitrified abrasive materials for precision grinding applications. Proceedings of Engineering Sciences 28 5 (2003) 897-914
19. E. Bright, M. Wu, Porous abrasive articles with agglomerated abrasives, US Patent 6679758, 2004.
20. Salmon S.C. Modern Grinding Process Technology (1992), McGraw-Hill, New York
21. Drozda T.J., and Wick C. Tool and Manufacturing Engineers Handbook vol. 1 (1983), Machining, Society of Manufacturing Engineers, Michigan
22. Braun O., Warnecke G., and Aurich J.C. Simulation-based development of a superabrasive grinding wheel with defined grain structure. Transactions of North American Manufacturing Research Institution 33 (2005) 351-358
23. Malkin S., and Cook N.H. The wear of grinding wheels. Journal of Engineering for Industry 93 (1971) 1120-1133
24. Karpac C., Honaker K., and Fogarty T. Save time and money with the right abrasive wheels. Welding Journal 83 5 (2004) 38-41
25. Liu Y.K., and Tso P.L. The optimal diamond wheels for grinding diamond tools. International Journal of Advanced Manufacturing Technology 22 5-6 (2003) 396-400
26. Andersson J., Hollman P., and Jacobson S. Abrasive capacity of thin film diamond structures. Key Engineering Materials 196 (2001) 141-148
27. Golabczak A., and Koziarski A. Electrochemical dressing of metal bonded superhard grinding wheels. Industrial Diamond Review 62 592 (2002) 25-29
28. Tanaka T., Esaki S., Nishida K., Nakajima T., and Ueno K. Development and application of porous vitrified-bonded wheel with ultra-fine diamond abrasives. Key Engineering Materials 257-258 (2004) 251-256
29. W.J. Sherwood Jr., Ceramic bonded abrasive, US Patent 20030041525, 2003.
30. Jackson M.J., and Mills B. Materials selection applied to vitrified alumina & CBN grinding wheels. Journal of Materials Processing Technology 108 1 (2000) 114-124
31. Wang Y.H., Zhao Y.C., Wang M.Z., and Zang J.B. Structure and properties of diamond grits coated with corundum micron powders. Key Engineering Materials 250 (2003) 94-98
32. E. Ihara, Metal-coated abrasives, grinding wheel using metal-coated abrasives and method of producing metal-coated abrasives, US Patent 20050129975, 2005.
33. N. Fuwa, H. Shibutani, O. Horiuchi, H. Suzuki, J. Jkeno, Mirror grinding of silicon wafer with silica EPD Pellets-effects of air-cooling, Proceedings of the Fourth International Symposium on Advances in Abrasive Technology, Seoul, Korea, November 6-9, (2001) 295-302.
34. T. Fukazawa, N. Fuwa, J. Ikeno, H. Shibutani, O. Horiuchi, H. Suzuki, Mirror grinding of silicon wafer with silica EPD Pellets, Proceedings of the Tenth International Conference on Precision Engineering, (2001) 366-370.
35. H. Shibutani, J. Ikeno, O. Horiuchi, K. Yano, Mirror grinding of silicon wafer with EPD pellet, Proceedings of the Ninth International Conference on Production Engineering, Osaka, Japan, 29.08-01.09, (1999) 98-102.
36. Yamamoto Y., Maeda H., Shibutani H., Suzuki H., and Horiuchi O. A study on constant-pressure grinding with EPD pellets. Key Engineering Materials 257-258 (2004) 135-138
37. D. Matsumoto, W.F. Waslaske, B.L. Sale, Abrasive tools for grinding electronic components, US Patent 6394888, 2002.
38. Ohmori H., and Nakagawa T. Mirror surface grinding of silicon wafers with electrolytic in-process dressing. CIRP annals-Manufacturing Technology 39 1 (1990) 329-332
39. Asahi Diamond Industrial, 2000, "Diamond & CBN wheels," retrieved from: 〈http://www.asahidia.co.jp/pdf/B07.pdf〉.
40. Fujimi Website, 〈http://www.fujimico.com〉.
41. Shinhan Diamond Industrial Website, 〈http://www.shinhandia.com〉.
42. Disco Website, 〈http://www.disco.co.jp〉.
43. Asahi Diamond Industrial Website, 〈http://www.asahidia.co.jp〉.
44. Saint-Gobain Abrasives Website, 〈http://www.nortonabrasives.com〉.
45. Carlisle K., and Stocker M.A. Cost-effective machining of brittle materials (glasses and ceramics) eliminating/minimizing the polishing process. Proceedings of the International Society for Optical Engineering 3099 (1997) 46-58
46. Itoh N., and Ohmori H. Development of metal-free conductive bonded diamond wheel for environmentally friendly electrolytic in-process dressing (ELID) grinding. New Diamond and Frontier Carbon Technology 14 4 (2004) 227-238
47. Jackson M.J. Wear of perfectly sharp abrasive grinding wheels. Transactions of North American Manufacturing Research Institution of SME 30 (2002) 287-294
48. G. F. Stoica, C. Capitanescu, A.I. Biolan, Wear behaviour of thin coatings based on diamond, National Tribology Conference, September 24-26, (2003) 133-135.
49. S. Ramanath, S.Y. Kuo, W.H. Willistion, S.T. Buljan, Method for grinding precision components, US Patent 6019668, 2000.
50. T. Nonogawa, T. Kondo, Segmental type grinding wheel, US Patent 6846233, 2005.
51. Jackson M.J., and Mills B. Vitrification heat treatment and dissolution of quartz in grinding wheel bonding systems. British Ceramic Transactions 100 1 (2001) 1-9
52. K. Itoh, Vitrified abrasive solid mass reinforced by impregnation with synthetic resin, and method of manufacturing the same, US Patent 6093225, 2000.
53. Zhou Y.Y., Atwood M., Golini D., Smith M., and Funkenbuseh P.D. Wear and self-sharpening of vitrified bond diamond wheels during sapphire grinding. Wear 219 (1998) 42-45
54. Smith M., Schmid F., Khattack C.P., Schmid K., Golini D., Lambropoulos J., Atwood M., Zhou Y., and Funkenbusch P.D. Sapphire fabrication for precision optics. Proceedings of SPIE-The International Society for Optical Engineering 2857 (1996) 99-112
55. H. Ohmori, N. Itoh, T. Kasai, T. Karaki-Doy, K. Horio, T. Uno, M. Ishii, Metal-resis bond grindstone and method for manufacturing the same, US Patent 6203589, 2001.
56. Abrasive Engineering Society, "Glossary," 9/29/2004, retrieved from: 〈http://www.abrasiveengineering.com/glossary.htm〉.
57. S. Ramanath, S.T. Buljan, J.R. Wilson, J.A.S. Ikeda, Porous abrasive tool and method for making the same, US Patent 20030232586, 2003.
58. 2. Journal of the American Ceramic Society 88 7 (2005) 1729
59. P. Scheffer, 2000, Recrystallised glass bonds: new lease of life for conventional abrasives, Industrial Product News Online, June 2000, retrieved from: 〈http://www.ipnews.com/archives/grinding/june00/a_wiggri.htm〉.
60. H.G. Eisenberg, G. Bigorajski, Method for the manufacture of granular grit for use as abrasives, US Patent 4393021, 1983.
61. K. Kajiyama, Electrodeposited grinding tool, US Patent 4547998, 1985.
62. Z.J. Pei, A. Strasbaugh, Fine grinding of silicon wafers: grinding marks, CD-ROM Proceedings of the International Mechanical Engineering Congress and Exposition 2002 (IMECE 2002), vol. 2, New Orleans, LA, November 17-22 (2002).
63. Zhang X.H., Pei Z.J., and Fisher G.R. A grinding-based manufacturing method for silicon wafers: generation mechanisms of central dimples on ground wafers. International Journal of Machine Tools and Manufacture 46 3-4 (2006) 397-403