Dicing of fragile MEMS structures

Materials Research Society Symposium Proceedings

Volumn 1139, Issue , 2009, Pages 19-24

  Lange, Peter ^a   Marenco, Norman ^a   Gruenzig, Sven ^a   Warnat, Stephan ^a   Semperowitsch, Thilo ^b  

^a FRAUNHOFER INSTITUTE FOR SILICON TECHNOLOGY ISIT   (Germany)

^b Accretech GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DICING METHOD; MEMS-STRUCTURE; MICROMACHINED STRUCTURES; OPERATING MODES; SEM; THREE DIMENSIONAL INTEGRATION; WATER JETS;

DEBRIS; JETS; MEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 70449581241     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. N. Marenco, H. Kostner, W. Reinert, and G. Hillmann, Smart System Integration, Barcelona (2008), Proceedings, p. 351
2. P. Merz, W. Reinert, K. Reimer, B. Wagner, Konferenzband Mikrosystemtechnik-Kongress 2005, D/Freiburg, VDE Verlag, p. 467-470
3. M. Kumagai, N. Uchiyama, E. Ohmure, R. Sugiura, K. Atsumi, and K. Fukumitsu, IEEE Transaction on Semiconductor Manufactoring, 20 (3), 2007, p. 259
4. E. Ohmura, F. Fukuyo, K. Fukumitsu, and H. Morita, JAMME, Vol. 17 (1-2), 2006, 381
5. T. Monodane, E. Ohmura, F. Fukuyo, K. Fukumitsu, H. Morita, and Y. Hirata, JLMN-Journal of Laser Micro/Nanoengineering, Vol. 1 (3) 2006, 231
6. M. F. von Allmen, Coupling of laser radiation to metals and semiconductors, in M. Bertolotti (Ed), Physical Processes in Laser-Material Interactions, 1983 Plenum Press, New York, page 49
7. Private communication with H. Bernt