Backside processing steps elimination and cost reduction by multi beam full cut laser dicing

2011 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2011

Volumn , Issue , 2011, Pages

  Evertsen, Rogier ^a   Hendriks, Rene ^a  

^a Advanced Laser Separation International   (Netherlands)

Author keywords

Backside metal; Die strength; Full cut; Laser dicing; Singulation

Indexed keywords

BACKSIDE METAL; DIE STRENGTH; FULL CUT; LASER DICING; SINGULATION;

COST REDUCTION; METAL CUTTING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 84887359476     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. T. A. Abshere, et al., Lessons Learned from Laser Dicing, 2008 CS MANTECH Technical Digest, pp. 69-71, April 2008.
2. R. Hendriks, et al., Paradigm Shift in Compound Semiconductor Production since the Introduction of Laser Dicing 2009 CS Mantech Technical Digest, May 2009.
3. P. Chall, 65th Japan Laser Material Processing conference (JLPS), 2005.
4. J. Borkulo, et al., Enabling Technology in Thin Wafer Dicing, 2010 CSTIC Semicon China, March 2010.