Thin silicon wafer dicing with a dual-focused laser beam

Journal of Micromechanics and Microengineering

Volumn 17, Issue 12, 2007, Pages 2505-2515

  Venkatakrishnan, Krishnan ^a   Tan, Bo ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

LASER BEAMS; PARAMETER ESTIMATION; THIN FILMS;

LASER PARAMETERS; LASER WAFER DICING;

SILICON WAFERS;

EID: 36949017958     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/12/017     Document Type: Article

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