High-density compliant die-package interconnects

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1233-1238

  Muthukumar, Sriram ^a   Hill, Charles D ^a   Ford, Stan ^a   Worwag, Wojciech ^a   Dambrauskas, Tony ^a   Challela, Palmer C ^a   Dory, Thomas S ^a   Patel, Neha M ^a   Ramsay, Edward L ^a   Chau, David S ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIE-PACKAGE INTERCONNECTS; END-OF-LINE (EOL) DATA; PACKAGE SUBSTRATE; THERMOMECHANICAL SIMULATION;

CRACK INITIATION; FLIP CHIP DEVICES; PERMITTIVITY; SILICON; THERMAL EXPANSION; THERMOMECHANICAL TREATMENT;

INTERCONNECTION NETWORKS;

EID: 33845575291     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645810     Document Type: Conference Paper

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