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Volumn , Issue , 2009, Pages
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Advanced solutions for ultra-thin wafers and packaging
a
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Author keywords
Conventional process; Cool expansion; DBG; Stealth dicing; TAIKO; TSV
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Indexed keywords
ADVANCED PACKAGING;
CONVENTIONAL PROCESS;
CORE TECHNOLOGY;
NEW APPROACHES;
PACKAGING INDUSTRY;
POWER DEVICES;
PROCESS FLOWS;
SEMICONDUCTOR INDUSTRY;
STATE OF THE ART;
THROUGH-SILICON-VIA;
ULTRA-THIN;
WAFER THINNING;
DIES;
LOGIC DEVICES;
MICROELECTRONICS;
NICKEL POWDER METALLURGY;
PACKAGING;
SEMICONDUCTOR DEVICE MANUFACTURE;
SILICON WAFERS;
ELECTRONICS PACKAGING;
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EID: 70449835873
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (19)
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References (0)
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