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Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2009, Pages 208-214

Characterization of DAF tape for embedded micro wafer level packaging

(5) Pei Siang, Sharon Lim a Sharma, Gaurav a Kumar, Aditya a Rao, Vempati Srinivasa a Sheng, Vincent Lee Wen a

a INSTITUTE OF MICROELECTRONICS (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY COSTS; BOND FORCE; BONDING PARAMETERS; BONDING PRESSURE; BONDING PROCESS; BONDING TEMPERATURES; BONDING TIME; BONDLINE THICKNESS; CONTRIBUTING FACTOR; DICING PROCESS; DIE ATTACH FILM; DIE ATTACH PROCESS; DIE SHEAR TEST; DIE-ATTACH MATERIALS; ELECTRONICS PRODUCTS; FINE PITCH; FORM FACTORS; MATERIALS CHARACTERIZATION; MOISTURE SENSITIVITY; PACKAGING TECHNOLOGIES; PORTABLE PRODUCTS; THIN WAFERS; WAFER LEVEL; WAFER LEVEL PACKAGING;

APPROXIMATION THEORY; CAMERAS; DIES; ELECTRONICS INDUSTRY; PACKAGING; TAPES; TECHNOLOGY; TELECOMMUNICATION EQUIPMENT; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 77950941007 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2009.5416548 Document Type: Conference Paper

Times cited : (1)

References (7)

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2
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5
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6
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- Wafer Sawing Process Characterisation for Thin Die (75 micron) Applications
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- Proc IEEE 29th IEMT Symp., 2004 , pp. 74-77
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7
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- Process and Material Characterization of Die Attach Film (DAF) for Thin Die Applications
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.