Significant step in wafer yield optimization and operation cost reduction due to dicing innovation

2006 International Conference on Compound Semiconductor Manufacturing Technology

Volumn , Issue , 2006, Pages 141-144

  Muller M C ^a   Hendriks, R ^a   Chall, H P ^a  

^a Advanced Laser Separation International   (Netherlands)

Author keywords

Die strength; Laser dicing; Multiple beam dicing

Indexed keywords

DIE STRENGTH; ELECTRICAL PERFORMANCE; LASER DICING; MULTIPLE BEAM; MULTIPLE BEAM LASERS; PROCESS CAPABILITIES; QUALITY DETERIORATIONS; SEMICONDUCTOR COMPONENTS;

SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 84887420421     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. P. Chall, "ALSI's Low Power Multiple Beam Technology for High Throughput and Low Damage Wafer Dicing", in Proceedings of the 65th Laser Materials Processing Conference, Japan Laser Processing Society, pp. 197-200, 2005.
2. M. C. Müller, R. Hendriks, H. P. Chall, "A Break through in Dice through Compound semiconductor wafers", in Technical digest of the Compound Semiconductor Manufacturing Expo, Institute of Physics Publishing Ltd, pp. 159-161, 2005.