A high-repetition-rate femtosecond laser for thin silicon wafer dicing

Journal of Micromechanics and Microengineering

Volumn 18, Issue 7, 2008, Pages

  Venkatakrishnan, Krishnan ^a   Sudani, Nitin ^a   Tan, Bo ^a  

^a RYERSON UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BORON; INDUSTRIAL APPLICATIONS; LASERS; MACHINING; NONMETALS; POWER QUALITY; PULSED LASER APPLICATIONS; PULSED LASER DEPOSITION; SILICON; ULTRASHORT PULSES;

BORON DOPING; COMPACT UNIT; CUTTING SPEEDS; FEMTOSECOND (FS) LASERS; HIGH POWERS; HIGH REPETITION RATES; INFRARED (IR); KERF WIDTHS; LASER PARAMETERS; OUTPUT POWERS; REAL WORLD; SINGULATION; SYSTEMATIC STUDY; THIN SILICON WAFER; THIN WAFER DICING;

SILICON WAFERS;

EID: 47249129026     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/7/075032     Document Type: Article

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