Dicing technology in super-thin wafer for IC

ICEPT 2003 - 5th International Conference on Electronic Packaging Technology, Proceedings

Volumn , Issue , 2003, Pages 130-132

  Jiang, Jian ^a   Song, Chunlan ^a   Zhang, Zhenglin ^a  

^a Wuxi China Resources Huajing Micro Electronic CO LTD   (China)

Author keywords

Assembly; Blades; Ceramics; Heart; Ink; Joining processes; Microelectronics; Presses; Silicon; Wheels

Indexed keywords

ASSEMBLY; CERAMIC MATERIALS; CHIP SCALE PACKAGES; CRACKS; ELECTRONICS PACKAGING; HEART; INK; MICROELECTRONICS; PRESSES (MACHINE TOOLS); SILICON; WHEELS;

ASSEMBLY PLANTS; BLADES; CERAMICS; DICING PROCESS; JOINING PROCESS; PROCESS IMPROVEMENT; QUALITY PROBLEMS; UNIVERSAL METHOD;

SILICON WAFERS;

EID: 84946414985     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1298708     Document Type: Conference Paper

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