Reliability improvement of 90nm large flip chip low-k die via dicing and assembly process optimization

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 622-626

  Chaware, Raghunandan ^a   Lan, Hoang ^a  

^a XILINX INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY PROCESSING; CHEMICAL-; DIAMOND BLADES; DIE SIZE; ELECTRICAL PERFORMANCES; ENHANCED DIELECTRIC PROPERTIES; FIELD PROGRAMMABLE GATE ARRAY; FLIP CHIP DIES; FLIP CHIP RELIABILITY; FLIP CHIPPING; LASER DICING; LASER GROOVING; LOGIC CELLS; LOW-K DIELECTRIC MATERIALS; LOW-K MATERIALS; MECHANICAL DICING; PACKAGING TECHNOLOGIES; POOR ADHESION; PROCESS WINDOWS; PROCESSING SPEEDS; RELIABILITY IMPROVEMENT; SIGNAL ROUTING; SILICON TECHNOLOGIES; SINGULATION; UNDERFILL;

ADHESION; CHEMICAL PROPERTIES; CHIP SCALE PACKAGES; DIAMONDS; DIELECTRIC PROPERTIES; DIES; ELECTRIC CURRENTS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; FIELD PROGRAMMABLE GATE ARRAYS (FPGA); FLIP CHIP DEVICES; LASERS; LITHOGRAPHY; LOGIC DEVICES; MATERIALS PROPERTIES; MATERIALS SCIENCE; MECHANICAL PROPERTIES; NONMETALS; OPTIMIZATION; QUALITY ASSURANCE; RELIABILITY; RELIABILITY ANALYSIS; SILICON; SILICON WAFERS; SPEED; STRESSES; TECHNOLOGY; THERMAL EXPANSION; THERMAL SPRAYING;

DIELECTRIC MATERIALS;

EID: 50249085545     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342785     Document Type: Conference Paper

References (3)

1. Bolanos, M., A., "Semiconductor Integrated Circuit Packaging Technology Challenges - Next Five Years", International Symposium on Electronics Materials and Packaging, December 2005, Tokyo, Japan, pp. 6-9.
2. Hussein, M., A. and He, J., "Materials' Impact on Interconnect Process Technology and Reliability", IEEE Transactions on Semiconductor Manufacturing, Vol. 18, No. 1 (2005), pp. 69-85.
3. Cheung, A., T., "Dicing Advanced Materials for Microelectronics", International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, March 2005, Irvine, California, USA, pp. 149-152.