Feasibility analysis for dry plasma scribe lane etch for die separation in compound semiconductors

III-Vs Review

Volumn 15, Issue 6, 2002, Pages 48-51

  Almerico, J P ^a   Werbaneth, P F ^a   Cho, Y K ^a  

^a Tegal Corporation   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; COSTS; PLASMA ETCHING; SAWING; SEMICONDUCTOR DEVICES; SEPARATION; STRESS ANALYSIS;

DIE SEPARATION;

SEMICONDUCTOR MATERIALS;

EID: 0036684577     PISSN: 09611290     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0961-1290(02)85187-0     Document Type: Article

References (4)

1. The back-end process: Step 11 - Scribe and break