Experimental determination of the toughness of crack stop structures

Proceedings of the IEEE 2007 International Interconnect Technology Conference - Digest of Technical Papers

Volumn , Issue , 2007, Pages 114-116

  Shaw, T M ^a   Liniger, E ^a   Bonilla, G ^a   Doyle, J P ^a   Herbst, B ^a   Liu, X H ^a   Lane, M W ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FRACTURE TOUGHNESS; STRESS ANALYSIS; TENSILE TESTING;

ADHESION TESTING; CRACKSTOP TOUGHNESS; DICING FLAWS;

CRACK PROPAGATION;

EID: 34748906141     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/iitc.2007.382368     Document Type: Conference Paper

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