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Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 13-18

Thin chips on the ITRS roadmap

(1) Burghartz, Joachim N a

a Institut fur Mikroelektronik Stuttgart (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84864261768 PISSN: None EISSN: None Source Type: Book
DOI: 10.1007/978-1-4419-7276-7_2 Document Type: Chapter

Times cited : (2)

References (5)

1
- 0000793139
- Cramming more components onto integrated circuits
- Moore GE (1965) Cramming more components onto integrated circuits. Electronics 38(8):114-116
- (1965) Electronics , vol.38 , Issue.8 , pp. 114-116
- Moore, G.E.¹

2
- 84892000938
- http://www.itrs.net/reports.html

3
- 85001136347
- A global interconnect design window for a three-dimensional system-on-a-chip
- Burlingame, CA
- Joyner JW, Zarkesh-Ha P, Meindl JD (2001) A global interconnect design window for a three-dimensional system-on-a-chip. In: Proceedings of the IITC, Burlingame, CA, pp 154-156
- (2001) Proceedings of the IITC , pp. 154-156
- Joyner, J.W.¹ Zarkesh-Ha, P.² Meindl, J.D.³

4
- 72849143043
- Ultra-thin chips and related applications, a new paradigm in silicon technology
- Athens, Greece
- Burghartz JN, Appel W, Harendt C, Rempp H, Richter H, Zimmermann M (2009) Ultra-thin chips and related applications, a new paradigm in silicon technology. In: Proceedings of the ESSDERC, Athens, Greece, pp 29-36
- (2009) Proceedings of the ESSDERC , pp. 29-36
- Burghartz, J.N.¹ Appel, W.² Harendt, C.³ Rempp, H.⁴ Richter, H.⁵ Zimmermann, M.⁶

5
- 0020127035
- Silicon as a mechanical material
- Peterson K (1982) Silicon as a mechanical material. In: Proceedings of the IEEE, vol 70, no. 5, pp 420-457
- (1982) Proceedings of the IEEE , vol.70 , Issue.5 , pp. 420-457
- Peterson, K.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.