Die attach film performance in 3D QFN stacked die

WSEAS Transactions on Applied and Theoretical Mechanics

Volumn 3, Issue 3, 2008, Pages 104-113

  Jalar, A ^a   Rosle, M F ^a   Hamid, M A A ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

Delamination; Die attach film; QFN

Indexed keywords

3-DIMENSIONAL; ACOUSTIC TESTING; BONDING CONDITIONS; BONDING TEMPERATURES; CHARACTERISATION; CONSUMER DEMANDS; DIE ATTACH; DIE ATTACH FILM; DIE ATTACH PROCESS; DIE STACKING; FILM PERFORMANCE; INTERFACIAL DELAMINATION; IT PERFORMANCE; KEY TECHNOLOGIES; MECHANICAL ADHESION; MOISTURE SENSITIVITY LEVEL; QFN; RELIABILITY PERFORMANCE; SCANNING CALORIMETRY; SEMICONDUCTOR INDUSTRIES; SHEAR TESTING; THERMAL RESISTANCE;

CONSUMER PRODUCTS; DELAMINATION; DIFFERENTIAL SCANNING CALORIMETRY; EQUIPMENT TESTING; LASER INTERFEROMETRY; SCANNING; SEMICONDUCTOR DEVICE MANUFACTURE; STEEL SHEET;

DIES;

EID: 78651555762     PISSN: 19918747     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. R. Heikkila, J. Tanskanen and E. O. Restolainen, Reliability Study of 3D Stacked Structures, Electronic Components and Technology Conference, 2002, pp. 1449-1453.
2. N. C. Chiang, Evaluation of Different Die Attach Films and Paste for Stacked Die Package, International Conference on Electronics Materials and Packaging, Vol.5, 2003, pp. 27-32.
3. S.N. Song, H.H. Tan and P.L. Ong, Die Attach Film Application in Multi Die Stack Package, Electronics Packaging Technology Conference, 2005, pp. 848-852.
4. S. Takeda and T. Masuko, Novel Die Attach Films Having High Reliability Performance for Lead-free Solder and CSP, Electronic Components and Technology Conference, 2000, pp. 1616-1622.
5. S. Takeda, T. Masuko, Y. Miyadera, M. Yamazaki and I. Maekawa, A Novel Die Bonding Adhesive-Silver Filled Film, Electronic Components and Technology Conference, Vol.4, 1997, pp. 518-524.
6. I. Ahmad, N. N. Bachok, N. C. Chiang, M. Z. M. Talib, M. F. Rosle, F. L. A. Latip and Z. A. Aziz, Evaluation of Different Die Attach Film and Epoxy Pastes for Stacked Die QFN Package, Electronics Packaging Technology Conference, Vol.9, 2007, pp. 869-873.
7. C. L. Chung and S. L. Fu, A Study on the Characteristic of UV cured Die-attach Films In Stack CSP (Chip Scale Package), International Conference on Microelectronics, 2003, pp. 365-368.
8. H. H. Jiun, I. Ahmad, A. Jalar, and G. Omar, Alternative Double Pass Dicing Method for Thin Wafer Laminated with Die Attach Film, International Conference on Semiconductor Electronics, 2004 pp. 636-641.
9. S. Abdullah, S. M. Yusof, I. Ahmad, A. Jalar and R. Daud, Dicing Die Attach Film for 3D Stacked Die QFN Packages, International Electronics Manufacturing Technology Symposium, Vol.31, 2007, pp. 73-75.
10. C. A. Harper, Electronic Packaging and Interconnection Handbook, McGraw-Hill Companies, 2005.
11. L. L. Mercado, H. Wieser and T. Hauck, Multichip Package Delamination and Die Fracture Analysis, IEEE Transactions on Advanced Packaging, Vol.26, 2003, pp. 152-159.
12. J-STD-020C Joint IPC/JEDEC Standard for Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface-Mount Devices (Jul 2004).