Highest-speed dicing of thin silicon wafers with nanosecond-pulse 355nm q-switched laser source using line-focus fluence optimization technique

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7585, Issue , 2010, Pages

  Bovatsek, James M ^a   Patel, Rajesh S ^a  

^a Spectra Physics Lasers Division   (United States)

Author keywords

Laser ablation; Laser cutting; Nanosecond pulse; Thin silicon; UV laser; Wafer dicing

Indexed keywords

CIRCULAR BEAMS; CUTTING DEPTH; CUTTING PROCESS; DICING PROCESS; FLUENCES; IN-PROCESS; LASER CUTTING; LASER HEATS; LASER LINES; LASER SOURCES; LINE-FOCUS; MICROELECTRONICS INDUSTRY; NANOSECOND PULSE; NEWPORT; OPTIMAL PROCESS; OPTIMIZATION TECHNIQUES; OUTPUT POWER; SAW DICING; THIN SILICON WAFER; THIN WAFERS; UV LASERS; WAFER DICING;

LASER ABLATION; LASER BEAMS; MICROELECTRONICS; OPTIMIZATION; PULSED LASER APPLICATIONS; Q SWITCHING; SAWING; SAWS; SEMICONDUCTING SILICON COMPOUNDS; ULTRAVIOLET LASERS;

SILICON WAFERS;

EID: 77951731651     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.845298     Document Type: Conference Paper

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