Analysis of flip-chip packaging challenges on copper/low-k interconnects

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 4, 2003, Pages 111-118

  Mercado, Lei L ^a   Goldberg, Cindy ^b   Kuo, Shun Meen ^b   Lee, Tien Yu ^b   Pozder, Scott K ^b  

^a INTEL CORPORATION   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Adhesive failure; Cohesive failure; Copper low k; Crack driving force; Flip chip packages; Increase in metal layers; Interfacial delamination; Last inter layer dielectric (ILD) material; Multilevel submodeling; Simulation

Indexed keywords

ADHESION; COMPUTER SIMULATION; COPPER; DIELECTRIC MATERIALS; FLIP CHIP DEVICES; RELIABILITY; SILICA; THIN FILMS;

ADHESIVE FAILURES; COHESIVE FAILURES; COPPER LOW-K; CRACK DRIVING FORCE; FLIP-CHIP PACKAGES; INCREASE IN METAL LAYERS; INTERFACIAL DELAMINATION; LAST INTER-LAYER DIELECTRIC (ILD) MATERIALS; MULTILEVEL SUBMODELING;

ELECTRONICS PACKAGING;

EID: 3042850450     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.821541     Document Type: Review

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