메뉴 건너뛰기




Volumn 5340, Issue , 2004, Pages 153-163

Ablation of metals and semiconductors with ultrashort-pulsed lasers: Improving surface qualities of microcuts and grooves

Author keywords

Cutting; Femtosecond; Focus; Grooves; Laser; Microstructure

Indexed keywords

GRAIN SIZE AND SHAPE; INDUSTRIAL APPLICATIONS; OPTIMIZATION; PARAMETER ESTIMATION; THERMAL EFFECTS; WAVE PROPAGATION;

EID: 3543130129     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.530692     Document Type: Conference Paper
Times cited : (25)

References (14)
  • 8
    • 85076572410 scopus 로고
    • Femtosecond pulse laser ablation of metallic, semiconducting, ceramic and biological materials
    • W. Kautek, J. Krüger, "Femtosecond pulse laser ablation of metallic, semiconducting, ceramic and biological materials", Proceedings of SPIE 2207, 1994.
    • (1994) Proceedings of SPIE , vol.2207
    • Kautek, W.1    Krüger, J.2
  • 14
    • 0037670796 scopus 로고    scopus 로고
    • Ablation and cutting of planar silicon devices using femtosecond laser pulses
    • H. K. Tönshoff, K. Körber, A. Ostendorf, N. Bärsch, "Ablation and cutting of planar silicon devices using femtosecond laser pulses", Appl. Phys. A 77, 237-242, 2003.
    • (2003) Appl. Phys. A , vol.77 , pp. 237-242
    • Tönshoff, H.K.1    Körber, K.2    Ostendorf, A.3    Bärsch, N.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.