Integrated substrate technology

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1232-1236

  Chanchani, Rajen ^a   Bethke, Donald T ^a   Webb, Denise B ^a   Sandoval, Charlie ^a   Wouters, Gregg ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BUTENES; CAPACITORS; COMPUTER SIMULATION; COPPER; DIELECTRIC DEVICES; MICROELECTROMECHANICAL DEVICES; MICROSTRIP LINES; MULTILAYERS; RESISTORS; THIN FILM DEVICES;

BENZOCYCLOBUTENE (BCB); EMBEDDED CAPACITORS; SYSTEM ON A CHIP; THIN FILM RESISTORS;

CHIP SCALE PACKAGES;

EID: 10444236455     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. George Messner et al, Thin Film Multichip Modules International Society of Hybrid Microelectronic Society Publication, 1992.
2. P. Garrou et al, "MCM-D fabrication with Photosensitive Benzocyclobutene: (Processing, Solder Bumping, System Assembly and Testing)," Proceedings of the International Symposium on Microelectronics (ISHM), Los Angeles, CA, October, 1995, pp. 402-417.
3. Andrew Strandjord et al, "Process Optimization and Systems Integration of a Copper/Photosensitive Benzocyclobutene MCM-D: Dielectric Processing, Metallization, Solder Bumping, Device Assembly and Testing," The International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 3 (1996), pp 260-280.
4. L. W. Schaper et al, "Electrical Characterization of Thin Film Integral Passive Devices on Polyimide-Based Packaging Structures," The International Journal of Microcircuits and Electronic Packaging, Vol. 21, No. 4 (1998), pp 306-314.
5. Eric Beyne et al, "Integrated Passives for a DECT VCO," The International Conference & Exhibition on High Density Interconnect and System Packaging, Denver, CO, April, 2000, pp.537-541.
6. R. Kulke et al, "RF Benchmark up to 40 GHz for various LTCC Low Loss Tapes," Proceedings of IMAPS-Nordic, Stockholm, Sweden, September, 2002, pp. 97-102.
7. Internal report, Sandia National Labs, Albuquerque, NM 87185.
8. P. Ramm et al "Three Dimensional Metallization for Vertically Integrated Circuits," Microelectronic Engineering, Vol. 37/38 (197) pp. 39-47.
9. rd Electronic and Component Technology Conference (ECTC), New Orleans, LA, June, 2003, pp. 631-633.
10. "Heterogeneously Integrated Micro-system-on-a-Chip," by Rajen Chanchani, Patent Pending"Process Optimization and Systems Integration of a Copper/Photosensitive Benzocyclobutene MCM-D: Dielectric Processing, Metallization, Solder Bumping, Device Assembly and Testing," The International Journal of Microcircuits and Electronic Packaging, Vol. 19, No. 3 (1996), pp 260-280.