Alternative double pass dicing method for thin wafer laminated with die attach film

Proceedings ICSE 2004 - 2004 IEEE International Conference on Semiconductor Electronics

Volumn , Issue , 2004, Pages 636-641

  Jiun, Hoh Huey ^a   Ahmad, Ibrahim ^a,c   Jalar, Azman ^a,c   Omar, Ghazali ^b,c  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

^c IEEE

Author keywords

Dual pass saw process; Laminated die attach film; Lateral crack; Stack die

Indexed keywords

DIES; ELECTRIC CONDUCTIVITY; LAMINATING; MICROSCOPIC EXAMINATION; SEMICONDUCTOR MATERIALS;

DOUBLE-PASS; DUAL PASS SAW PROCESS; LAMINATED DIE ATTACH FILM; LATERAL CRACK; STACK DIE;

CRACKS;

EID: 51349112222     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. Y.M. Cheung and Arthur C.M.Chong, "New Proposed Adhesive Tape Application Mechanism For Stacking Die Applications", International Conference on Electronic Packaging Technology, ICEPT 2003,
3. D.B. Marshall, A.G. Evans, et al, "The Nature of Machining Damage in Brittle Materials", Proceedings R.Soc., London A385, 1983 PP.461-475.
4. I. Weisshaus and G.Weissman, "Online Monitoring Of The Dicing Process", Future Fab, Issue 10, Technology Publishing Ltd., London, England.
5. J.Jian, C.H. Song, Z.L. Zhang, "Dicing Technology In Super-Thin Wafer for IC", International Conference on Electronic Packaging Technology, ICEPT 2003,
6. K.Gilleo, T.Cinque, S.Corbett, M. Corey, C. Lee & R. Miculich, "Thermoplastic Die Attach Adhesive for Today's Packaging Challenges".