Reducing chipping defects during GaAs wafer dicing with a four-point diamond tool

2008 International Conference on Compound Semiconductor Manufacturing Technology, CS MANTECH 2008

Volumn , Issue , 2008, Pages

  Chou, Jason ^a   Hua, Chang Hwang ^a   Yang, Sen ^a   Chen, Ping Wei ^a  

^a WIN SEMICONDUCTORS CORP   (Taiwan)

Author keywords

Diamond tool; Dicing; Scribe and break

Indexed keywords

APPLIED FORCES; AUTOMATIC INSPECTION SYSTEM; CUTTING DEPTH; DIAMOND-TOOL; DICING; FOUR-POINT; SCRIBE AND BREAK; WAFER DICING;

GALLIUM ARSENIDE; SEMICONDUCTOR DEVICE MANUFACTURE; TOOLS;

SEMICONDUCTING GALLIUM;

EID: 84887437016     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. DYNATEX INTERNATIONAL™, "Meeting the Challenge of Dicing and Fracturing Brittle III-V Materials".
2. How to select the Right Scribing-Tool for Your Application. APR. 1973.