Process and material characterization of die attach film (DAF) for thin die applications

2006 International Conference on Electronic Materials and Packaging, EMAP

Volumn , Issue , 2006, Pages

  Teo, Mary ^a   Soh, Choew Kheng ^a   Lee, Charles ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CRYSTAL WHISKERS; ELECTRIC CURRENTS; ELECTRONICS PACKAGING; LAMINATING; MATERIALS SCIENCE; MOISTURE; OPTIMIZATION; PACKAGING MATERIALS; RELIABILITY;

DIE ATTACH; ELECTRONIC MATERIALS AND PACKAGING; RELIABILITY TESTING;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 51449091581     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2006.4430572     Document Type: Conference Paper

References (8)

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3. S. N. Song et al, "Die Attach Film Application in Multi Die Stack Package", Proc. IEEE EPTC, pp. 848-852, 2005.
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5. H. H. Jiun et al, "Effect of Laminated Wafer toward Dicing Process and Alternative Double Pass Sawing Method to Reduce Chipping", IEEE Trans. Elect. Pkg. Manuf., Vol. 29, No. 1, pp. 17-24, 2006.
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8. J. Medding et al, "Thin Die Bonding Techniques", Proc. IEEE 29th IEMT Symp., pp. 68-73, 2004.