Separation of extremely miniaturized medical sensors by IR laser dicing

Journal of Optoelectronics and Advanced Materials

Volumn 12, Issue 3, 2010, Pages 479-483

  Birkholz, M ^a   Ehwald, K E ^a   Kaynak, M ^a   Semperowitsch, T ^b   Holz, B ^b   Nordhoff, S ^c  

^a IHP   (Germany)

^b Accretech GmbH   (Germany)

^c NXP SEMICONDUCTORS   (Germany)

Author keywords

Glucose sensor; MEMS; Si wafer; Stealth dicing

Indexed keywords

GLUCOSE; GLUCOSE SENSORS; MEMS; SEPARATION; SILICON WAFERS;

BLOOD SUGAR LEVELS; CONTINUOUS MONITORING; GROUND PLATES; LATERAL DIMENSION; MEDICAL SENSORS; MICROCHIP SEPARATIONS; SI WAFER; STEALTH DICING;

PULSED LASERS;

EID: 77950633969     PISSN: 14544164     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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