Advanced dicing technology for semiconductor wafer - Stealth dicing

IEEE Transactions on Semiconductor Manufacturing

Volumn 20, Issue 3, 2007, Pages 259-265

  Kumagai, Masayoshi ^a   Uchiyama, Naoki ^a   Ohmura, Etusji ^b   Sugiura, Ryuji ^a   Atsumi, Kazuhiro ^a   Fukumitsu, Kenshi ^a  

^a CENTRAL RESEARCH LABORATORY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

Author keywords

Dicing; Dry processing; Laser processing; System in package; Thin ultra thin wafer

Indexed keywords

LIGHT ABSORPTION; PROBLEM SOLVING; SEMICONDUCTOR DEVICE MANUFACTURE;

DICING; DRY PROCESSING; LASER PROCESSING; SYSTEM IN PACKAGE; THIN/ULTRA-THIN WAFER;

SILICON WAFERS;

EID: 34547769226     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2007.901849     Document Type: Conference Paper

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