Debris-free low-stress high-speed laser-assisted dicing for multi-layered MEMS

IEEJ Transactions on Sensors and Micromachines

Volumn 130, Issue 4, 2010, Pages 118-123

  Fujita, Masayuki ^a,b   Izawa, Yusaku ^b   Tsurumi, Yosuke ^b   Tanaka, Shuji ^c   Fukushi, Hideyuki ^c   Sueda, Keiichi ^b   Nakata, Yoshiki ^b   Esashi, Masayoshi ^c   Miyanaga, Noriaki ^b  

^a INSTITUTE FOR LASER TECHNOLOGY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

Debris free laser dicing; Internal transformation; MEMS; Non contact wafer separation; Thermal stress

Indexed keywords

CARBON DIOXIDE; CRACKS; DEBRIS; FIBER LASERS; GLASS; MEMS; SEPARATION; SILICON; SILICON WAFERS; THERMAL STRESS;

HIGH SPEED LASER; INTERNAL TRANSFORMATION; LASER DICING; MECHANICAL SEPARATION; NON-CONTACT; SEPARATION PROCESS; THERMALLY INDUCED; YB FIBER LASERS;

PULSED LASERS;

EID: 77953592729     PISSN: 13418939     EISSN: 13475525     Source Type: Journal    
DOI: 10.1541/ieejsmas.130.118     Document Type: Article

References (5)

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5. Y. Izawa, Y. Tsurumi, S. Tanaka, H. Kikuchi, K. Sueda, Y. Nakata, M. Esashi, N. Miyanaga, and M. Fujita : "Debris-Free High-Speed Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS", IEEE J. Trans. SM, 129, 63 (2009).